Fans, Blowers, Thermal Management

WAVE-23-165

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LOW PROFILE HEAT SINK BGA CHIPSET ALUMINUM TOP MOUNT ROHS COMPLIANT: YES

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Fans, Blowers, Thermal Management

Active

LOW PROFILE HEAT SINK BGA CHIPSET ALUMINUM TOP MOUNT ROHS COMPLIANT: YES

Technical Specifications

Parameters and characteristics for this part

Specification	WAVE-23-165

Attachment Method	Clip
Fin Height [z]	16.51 mm
Fin Height [z]	0.65 in
Length	0.906 in
Length	23 mm
Material	Aluminum Alloy
Material Finish	Black Anodized
Package Cooled	BGA
Shape [custom]	Angled Fins
Shape [custom]	Square
Thermal Resistance @ Forced Air Flow	5.08 °C/W
Type	Board Level
Width	23 mm
Width	0.906 in

Part	Width	Width	Shape [custom]	Shape [custom]	Material	Attachment Method	Material Finish	Fin Height [z]	Fin Height [z]	Type	Package Cooled	Length	Length	Thermal Resistance @ Forced Air Flow
Wakefield Thermal Solutions WAVE-23-165	23 mm	0.906 in	Angled Fins	Square	Aluminum Alloy	Clip	Black Anodized	16.51 mm	0.65 in	Board Level	BGA	0.906 in	23 mm	5.08 °C/W
Wakefield Thermal Solutions WAVE-23-125	23 mm	0.906 in	Angled Fins	Square	Aluminum Alloy	Clip	Black Anodized	12.5 mm	0.492 in	Board Level	BGA	0.906 in	23 mm	6.76 °C/W
Wakefield Thermal Solutions WAVE-23-165	23 mm	0.906 in	Angled Fins	Square	Aluminum Alloy	Clip	Black Anodized	16.51 mm	0.65 in	Board Level	BGA	0.906 in	23 mm	5.08 °C/W
Wakefield Thermal Solutions WAVE-23-125	23 mm	0.906 in	Angled Fins	Square	Aluminum Alloy	Clip	Black Anodized	12.5 mm	0.492 in	Board Level	BGA	0.906 in	23 mm	6.76 °C/W

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

Heat Sink BGA Aluminum Alloy Board Level

Technical documentation and resources