WAVE-23 Series

Catalog

LOW PROFILE HEAT SINK BGA CHIPSET ALUMINUM TOP MOUNT ROHS COMPLIANT: YES

Part	Width	Width	Shape [custom]	Shape [custom]	Material	Attachment Method	Material Finish	Fin Height [z]	Fin Height [z]	Type	Package Cooled	Length	Length	Thermal Resistance @ Forced Air Flow
Wakefield Thermal Solutions WAVE-23-165	23 mm	0.906 in	Angled Fins	Square	Aluminum Alloy	Clip	Black Anodized	16.51 mm	0.65 in	Board Level	BGA	0.906 in	23 mm	5.08 °C/W
Wakefield Thermal Solutions WAVE-23-125	23 mm	0.906 in	Angled Fins	Square	Aluminum Alloy	Clip	Black Anodized	12.5 mm	0.492 in	Board Level	BGA	0.906 in	23 mm	6.76 °C/W
Wakefield Thermal Solutions WAVE-23-165	23 mm	0.906 in	Angled Fins	Square	Aluminum Alloy	Clip	Black Anodized	16.51 mm	0.65 in	Board Level	BGA	0.906 in	23 mm	5.08 °C/W
Wakefield Thermal Solutions WAVE-23-125	23 mm	0.906 in	Angled Fins	Square	Aluminum Alloy	Clip	Black Anodized	12.5 mm	0.492 in	Board Level	BGA	0.906 in	23 mm	6.76 °C/W