Fans, Blowers, Thermal Management

667-20ABPPE

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HEAT SINK, FOR BOARD LEVEL POWER SEMICONDUCTOR, 9.67 °C/W, TO-220, 34.9 MM, 50.8 MM, 12.7 MM

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Fans, Blowers, Thermal Management

Active

HEAT SINK, FOR BOARD LEVEL POWER SEMICONDUCTOR, 9.67 °C/W, TO-220, 34.9 MM, 50.8 MM, 12.7 MM

Technical Specifications

Parameters and characteristics for this part

Specification	667-20ABPPE

Attachment Method	PC Pin, Bolt On
Fin Height	2 in
Fin Height	50.8 mm
Length	12.7 mm
Length	0.5 in
Material	Aluminum
Material Finish	Black Anodized
Package Cooled	TO-220
Power Dissipation @ Temperature Rise	6 W
Shape [custom]	Rectangular
Shape [custom]	Fins
Thermal Resistance @ Forced Air Flow	4.7 °C/W
Type	Board Level, Vertical
Width	34.93 mm
Width [x]	1.375 in

Part	Package Cooled	Material	Material Finish	Fin Height	Fin Height	Shape [custom]	Shape [custom]	Attachment Method	Length	Length	Type	Thermal Resistance @ Forced Air Flow	Power Dissipation @ Temperature Rise	Width	Width [x]
Wakefield Thermal Solutions 667-20ABPPE	TO-220	Aluminum	Black Anodized	2 in	50.8 mm	Rectangular	Fins	Bolt On PC Pin	12.7 mm	0.5 in	Board Level Vertical	4.7 °C/W	6 W	34.93 mm	1.375 in
Wakefield Thermal Solutions 667-20ABPPE	TO-220	Aluminum	Black Anodized	2 in	50.8 mm	Rectangular	Fins	Bolt On PC Pin	12.7 mm	0.5 in	Board Level Vertical	4.7 °C/W	6 W	34.93 mm	1.375 in

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

Heat Sink TO-220 Aluminum 6.0W @ 58°C Board Level, Vertical

Technical documentation and resources