667-20 Series

Catalog

HEAT SINK, FOR BOARD LEVEL POWER SEMICONDUCTOR, 9.67 °C/W, TO-220, 34.9 MM, 50.8 MM, 12.7 MM

Part	Package Cooled	Material	Material Finish	Fin Height	Fin Height	Shape [custom]	Shape [custom]	Attachment Method	Length	Length	Type	Thermal Resistance @ Forced Air Flow	Power Dissipation @ Temperature Rise	Width	Width [x]
Wakefield Thermal Solutions 667-20ABPPE	TO-220	Aluminum	Black Anodized	2 in	50.8 mm	Rectangular	Fins	Bolt On PC Pin	12.7 mm	0.5 in	Board Level Vertical	4.7 °C/W	6 W	34.93 mm	1.375 in
Wakefield Thermal Solutions 667-20ABPPE	TO-220	Aluminum	Black Anodized	2 in	50.8 mm	Rectangular	Fins	Bolt On PC Pin	12.7 mm	0.5 in	Board Level Vertical	4.7 °C/W	6 W	34.93 mm	1.375 in