Texas Instruments

The EMB1412 MOSFET gate driver provides high peak gate drive current in 8-lead exposed-pad VSSOP package, with improved power dissipation required for high frequency operation. The compound output driver stage includes MOS and bipolar transistors operating in parallel that together sink more than 7-A peak from capacitive loads. Combining the unique characteristics of MOS and bipolar devices reduces drive current variation with voltage and temperature. Under-voltage lockout protection is provided to prevent damage to the MOSFET due to insufficient gate turn-on voltage. The EMB1412 provides both inverting and non-inverting inputs to satisfy requirements for inverting and non-inverting gate drive with a single device type. The EMB1412 MOSFET gate driver provides high peak gate drive current in 8-lead exposed-pad VSSOP package, with improved power dissipation required for high frequency operation. The compound output driver stage includes MOS and bipolar transistors operating in parallel that together sink more than 7-A peak from capacitive loads. Combining the unique characteristics of MOS and bipolar devices reduces drive current variation with voltage and temperature. Under-voltage lockout protection is provided to prevent damage to the MOSFET due to insufficient gate turn-on voltage. The EMB1412 provides both inverting and non-inverting inputs to satisfy requirements for inverting and non-inverting gate drive with a single device type.

The EMB1428 Switch Matrix Gate Driver IC is designed to work in conjunction with EMB1499 DC/DC Controller IC to support TI’s switch matrix based active cell balancing scheme in a battery management system. The EMB1428 provides 12 floating MOSFET gate drivers necessary for balancing up to 7 battery cells connected in a series stack. Multiple EMB1428 ICs may be used together to balance a stack of more than seven battery cells. The EMB1428 integrated circuit interfaces with the EMB1499 DC/DC controller to control and enable charging and discharging modes. The EMB1428 uses an SPI bus to accept commands from the main controller (CPU/MCU) on which battery cell should be charged or discharged and to report back any faults to the main controller (CPU/MCU). The EMB1428 Switch Matrix Gate Driver IC is designed to work in conjunction with EMB1499 DC/DC Controller IC to support TI’s switch matrix based active cell balancing scheme in a battery management system. The EMB1428 provides 12 floating MOSFET gate drivers necessary for balancing up to 7 battery cells connected in a series stack. Multiple EMB1428 ICs may be used together to balance a stack of more than seven battery cells. The EMB1428 integrated circuit interfaces with the EMB1499 DC/DC controller to control and enable charging and discharging modes. The EMB1428 uses an SPI bus to accept commands from the main controller (CPU/MCU) on which battery cell should be charged or discharged and to report back any faults to the main controller (CPU/MCU).

The EMB1499Q bidirectional current dc/dc controller IC works in conjunction with the EMB1428 switch matrix gate driver IC to support TI’s switch matrix based active cell balancing scheme for a battery management system. The EMB1499Q provides three PWM MOSFET gate signals to a bidirectional forward converter so that its output current, either positive or negative, is regulated around a user-defined magnitude. This inductor current is channeled by the EMB1428 through the switch matrix to the cell that needs to be charged or discharged. In a typical scheme, the EMB1499Q-based forward converter exchanges energy between a single cell and the battery stack to which it belongs, with a maximum stack voltage of up to 60 V. The switching frequency is fixed at 250 kHz. The EMB1499Q senses cell voltage, inductor current and stack current and provides protection from abnormal conditions during balancing. The EMB1499Q also provides an active clamp timing signal to control an external FET driver for the primary-side active clamp FET. The EMB1499Q is enabled and disabled by the EMB1428. Fault conditions detected by the EMB1499Q are communicated to the EMB1428 through the DONE and FAULT pins. The EMB1499Q bidirectional current dc/dc controller IC works in conjunction with the EMB1428 switch matrix gate driver IC to support TI’s switch matrix based active cell balancing scheme for a battery management system. The EMB1499Q provides three PWM MOSFET gate signals to a bidirectional forward converter so that its output current, either positive or negative, is regulated around a user-defined magnitude. This inductor current is channeled by the EMB1428 through the switch matrix to the cell that needs to be charged or discharged. In a typical scheme, the EMB1499Q-based forward converter exchanges energy between a single cell and the battery stack to which it belongs, with a maximum stack voltage of up to 60 V. The switching frequency is fixed at 250 kHz. The EMB1499Q senses cell voltage, inductor current and stack current and provides protection from abnormal conditions during balancing. The EMB1499Q also provides an active clamp timing signal to control an external FET driver for the primary-side active clamp FET. The EMB1499Q is enabled and disabled by the EMB1428. Fault conditions detected by the EMB1499Q are communicated to the EMB1428 through the DONE and FAULT pins.

The ESD1LIN24-Q1, ESD751-Q1, and ESD761-Q1 are single-channel low capacitance bidirectional ESD protection devices for local interconnect network (LIN). These devices are rated to dissipate contact ESD strikes beyond the maximum level specified in the IEC 61000-4-2 international standard (±30-kV Contact, ±30-kV Airgap), (±22-kV Contact, ±22-kV Airgap), and (±15-kV Contact, ±15-kV Airgap), respectively. The low dynamic resistance and low clamping voltage help protect systems against transient events. This protection is key as automotive systems require a high level of robustness and reliability when they control safety devices. The ESD1LIN24-Q1 and ESD751-Q1 are both offered in leaded packages for easy flow through routing. The ESD1LIN24-Q1, ESD751-Q1, and ESD761-Q1 are single-channel low capacitance bidirectional ESD protection devices for local interconnect network (LIN). These devices are rated to dissipate contact ESD strikes beyond the maximum level specified in the IEC 61000-4-2 international standard (±30-kV Contact, ±30-kV Airgap), (±22-kV Contact, ±22-kV Airgap), and (±15-kV Contact, ±15-kV Airgap), respectively. The low dynamic resistance and low clamping voltage help protect systems against transient events. This protection is key as automotive systems require a high level of robustness and reliability when they control safety devices. The ESD1LIN24-Q1 and ESD751-Q1 are both offered in leaded packages for easy flow through routing.

The ESD204 is a bidirectional TVS ESD protection diode array for HDMI and USB surge protection up to 5.5 A (8/20 µs). The ESD204 is rated to dissipate ESD strikes at the maximum level specified in the IEC 61000-4-2 international standard (Level 4). The low clamping and high differential bandwidth provided by ESD204 enables the device to cleanly pass high speed signals while providing robust protection to downstream devices. This device has a low capacitance of 0.55-pF per channel making it suitable for protecting high-speed interfaces up to 6 Gbps such as HDMI 2.0, HDMI 1.4, USB 3.0 and Ethernet 1G. The low dynamic resistance and low clamping voltage ensure system level protection against transient events. The ESD204 is offered in the industry standard USON-10 (DQA) package. The package features flow-through routing and 0.5-mm pin pitch easing implementation and reducing design time. The ESD204 is a bidirectional TVS ESD protection diode array for HDMI and USB surge protection up to 5.5 A (8/20 µs). The ESD204 is rated to dissipate ESD strikes at the maximum level specified in the IEC 61000-4-2 international standard (Level 4). The low clamping and high differential bandwidth provided by ESD204 enables the device to cleanly pass high speed signals while providing robust protection to downstream devices. This device has a low capacitance of 0.55-pF per channel making it suitable for protecting high-speed interfaces up to 6 Gbps such as HDMI 2.0, HDMI 1.4, USB 3.0 and Ethernet 1G. The low dynamic resistance and low clamping voltage ensure system level protection against transient events. The ESD204 is offered in the industry standard USON-10 (DQA) package. The package features flow-through routing and 0.5-mm pin pitch easing implementation and reducing design time.