Texas Instruments

The DDC316 is a 16-bit, 16-channel, current-input analog-to-digital converter (ADC). It combines both current-to-voltage and analog-to-digital (A/D) conversion so that 16 separate low-level current output devices (such as photodiodes) can be directly connected to its inputs and digitized. For each of the 16 inputs, the DDC316 provides a dual-switched integrator front-end. This configuration allows for continuous current integration: while one integrator is being digitized by the on-chip ADC, the other is integrating the input current. Adjustable integration times range from 10µs to 1ms. The DDC316 provides a serial interface of the output data, either multiplexed onto a single data output pin or parallel on four output pins. The output mode can be selected based on the available integration time. The DDC316 uses a +5V analog supply and a +3.3V digital supply. Operating over the temperature range of 0°C to +70°C, the DDC316 is offered in a BGA-64 package. The DDC316 is a 16-bit, 16-channel, current-input analog-to-digital converter (ADC). It combines both current-to-voltage and analog-to-digital (A/D) conversion so that 16 separate low-level current output devices (such as photodiodes) can be directly connected to its inputs and digitized. For each of the 16 inputs, the DDC316 provides a dual-switched integrator front-end. This configuration allows for continuous current integration: while one integrator is being digitized by the on-chip ADC, the other is integrating the input current. Adjustable integration times range from 10µs to 1ms. The DDC316 provides a serial interface of the output data, either multiplexed onto a single data output pin or parallel on four output pins. The output mode can be selected based on the available integration time. The DDC316 uses a +5V analog supply and a +3.3V digital supply. Operating over the temperature range of 0°C to +70°C, the DDC316 is offered in a BGA-64 package.

The DDC3256 is a 24-bit, 256-channel, current-input analog-to-digital (A/D) converter. It combines both, current-to-voltage conversion by current integration, and A/D conversion. Up to 256 individual low-level current output devices, such as photodiodes, can be directly connected to its inputs and digitized in parallel (simultaneously). For each of the 256 inputs, the device has one low noise and low power integrator designed to capture all the charge from the sensor. The integration time is adjustable from 50 µs to 1.6 ms, allowing currents in the order of fA to µA to be continuously measured with outstanding precision. The outputs of the integrators are digitized by on-chip low power ADCs and the converted digital codes are transmitted over a single LVDS pair designed to minimize noise coupling in environments with high channel count. The DDC3256 operates from single 1.85-V supply. The device is specified from 0°C to 70°C operating temperature and available in a 13.2 × 17.2 mm 2 336-ball 0.8 mm-pitch BGA. The on-chip reference buffer and bypass capacitors (on the BGA) help minimize the external component requirements and further reduce board space. The DDC3256 is a 24-bit, 256-channel, current-input analog-to-digital (A/D) converter. It combines both, current-to-voltage conversion by current integration, and A/D conversion. Up to 256 individual low-level current output devices, such as photodiodes, can be directly connected to its inputs and digitized in parallel (simultaneously). For each of the 256 inputs, the device has one low noise and low power integrator designed to capture all the charge from the sensor. The integration time is adjustable from 50 µs to 1.6 ms, allowing currents in the order of fA to µA to be continuously measured with outstanding precision. The outputs of the integrators are digitized by on-chip low power ADCs and the converted digital codes are transmitted over a single LVDS pair designed to minimize noise coupling in environments with high channel count. The DDC3256 operates from single 1.85-V supply. The device is specified from 0°C to 70°C operating temperature and available in a 13.2 × 17.2 mm 2 336-ball 0.8 mm-pitch BGA. The on-chip reference buffer and bypass capacitors (on the BGA) help minimize the external component requirements and further reduce board space.