LITTELFUSE

The SP3030-01ETG includes low capacitance rail to rail diodes with an additional Zener diode to provide protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes above the maximum level specified in the IEC61000-4-2 international standard (±20kV contact discharge) without performance degradation. The low loading capacitance makes it ideal for protecting high speed data lines such as HDMI, DVI,USB2.0, USB3.0 and eSATA.

The SP3031-01ETG is a single channel low capacitance diode that provides protection for electronic equipment that may experience destructive electrostatic discharges (ESD). This robust diode can safely absorb repetitive ESD strikes above the maximum level specified in the IEC 61000-4-2 international standard (Level 4, ±8 kV contact discharge and ±15 kV air discharge) without performance degradation. The low loading capacitance makes it ideal for protecting high speed data lines.

The SP3042-01WTG includes back-to-back TVS diodes fabricated in a proprietary silicon avalanche technology to provide protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes up to the maximum level specified in the IEC 61000-4-2 international standard (±30kV contact discharge) without performance degradation. The back-to-back configuration provides symmetrical ESD protection for data lines when AC signals are present and the low loading capacitance makes it ideal for protecting high speed data lines such as HDMI,USB2.0, USB3.0 and eSATA.

The SP3050 integrates low capacitance rail-to-rail diodes with an additional zener diode to protect each I/O pin against ESD and high surge events. This robust device can safely absorb surge current per IEC61000-4-5 (tP=8/20μs) without performance degradation and a minimum ±20kV ESD per IEC61000-4-2. Their very low loading capacitance also makes them ideal for protecting high speed signal pins.

This series will be End of Life (EOL) and is not recommended for new designs. Replacement will be the SC3051 series. The SP3051 integrates low capacitance rail-to-rail diodes with an additional zener diode to protect each I/O pin against ESD and high surge events. This robust component can safely absorb 20A of current per IEC 61000-4-5 (tP=8/20μs) without performance degradation and a minimum ±30kV ESD rating per IEC 61000-4-2 2nd edition. Their very low off-state capacitance is compatible with high speed circuits.

The SP3118-01ETG includes back-to-back TVS diodes fabricated in a proprietary silicon avalanche technology to provide protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes up to the maximum level specified in the IEC 61000-4-2 international standard without performance degradation. The back-to-back configuration provides symmetrical ESD protection.

The SP3118-01WTG includes back-to-back TVS diodes fabricated in a proprietary silicon avalanche technology to provide protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes up to the maximum level specified in the IEC 61000-4-2 international standard without performance degradation. The back-to-back configuration provides symmetrical ESD protection.

The SP3118E-01WTG provides ultra-low capacitance, bidirectional and a high level of protection for electronic equipment that may experience destructive electrostatic discharges (ESD). The typical capacitance of 0.3 pF helps ensure excellent signal integrity on the most challenging consumer electronics interfaces. It can safely absorb repetitive ESD strikes at ±30 kV (contact discharge, IEC 61000-4-2) without performance degradation and safely dissipate 3.5 A of 8/20μs surge current (IEC 61000-4-5 2ndedition).

The SP3130-01ETG includes back-to-back TVS diodes fabricated in a proprietary silicon avalanche technology to provide protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes up to the maximum level specified in the IEC61000-4-2 international standard without performance degradation. The back-to-back configuration provides symmetrical ESD protection for data lines when AC signals are present.

The SP3130-01WTG includes back-to-back TVS diodes fabricated in a proprietary silicon avalanche technology to provide protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes up to the maximum level specified in the IEC61000-4-2 international standard without performance degradation. The back-to-back configuration provides symmetrical ESD protection for data lines when AC signals are present.