Analog Devices Inc./Maxim Integrated

The HMC565LC5 is a high dynamic range GaAs PHEMT MMIC Low Noise Amplifier housed in a leadless RoHS compliant 5x5mm SMT package. Operating from 6 to 20 GHz, the HMC565LC5 features 21 dB of small signal gain, 2.5 dB noise figure and IP3 of +20 dBm across the operating band. This self-biased LNA is ideal for microwave radios due to its single +3V supply operation, and DC blocked RF I/O’s.ApplicationsPoint-to-Point RadiosPoint-to-Multi-Point Radios & VSATTest Equipment and SensorsMilitary & Space

The HMC566 is a high dynamic range GaAs PHEMT MMIC Low Noise Amplifier (LNA) chip which operates from 29 to 36 GHz. The HMC566 provides 20 dB of small signal gain, 2.8 dB of noise figure and output IP3 of 23.5 dBm across the operating band. This self-biased LNA is ideal for hybrid and MCM assemblies due to its compact size, slightly positive gain slope, single +3V supply operation, and DC blocked RF I/O’s. All data is measured with the chip in a 50 Ohm test fixture connected via two 0.025 mm (1 mil) diameter bondwires of minimal length 0.31 mm (12 mil).ApplicationsPoint-to-Point RadiosPoint-to-Multi-Point Radios & VSATTest Equipment and SensorsMilitary & Space

The HMC566LP4E is a high dynamic range GaAs pHEMT MMIC Low Noise Amplifier (LNA) in a 4x4 mm SMT package which operates from 28 to 36 GHz. The HMC566LP4E provides 21 dB of small signal gain, 2.8 dB of noise figure and output IP3 of +24 dBm. This self-biased LNA is ideal for hybrid and MCM assemblies due to its compact size, single +3V supply operation, and DC blocked RF I/O’s. The RoHS packaged HMC566LP4E eliminates the need for wirebonding and allows the use of high volume surface mount manufacturing techniques. The HMC566LP4E is also available in chip form as the HMC566.ApplicationsPoint-to-Point RadiosPoint-to-Multi-Point Radios & VSATMilitary & SpaceTest Equipment and Sensors

The HMC567LC5 is a compact GaAs MCM I/Q downconverter in a leadless RoHS compliant SMT package. This device provides a small signal conversion gain of 10 dB with a noise figure of 2.5 dB and 35 dB of image rejection across the frequency band. The HMC567LC5 utilizes an LNA followed by an image reject mixer which is driven by an LO buffer amplifier.The image reject mixer eliminates the need for a filter following the LNA, and removes thermal noise at the image frequency. I and Q mixer outputs are provided and an external 90° hybrid is needed to select the required sideband. The HMC567LC5 is a much smaller alternative to hybrid style image reject mixer downconverter assemblies, and it eliminates the need for wire bonding by allowing the use of surface mount manufacturing techniques.ApplicationsPoint-to-PointPoint-to-Multi-Point RadioEW & ELINT

The HMC570LC5 is a compact GaAs MMIC I/Q downconverter in a leadless RoHS compliant SMT package. This device provides a small signal conversion gain of 10 dB with a noise figure of 3 dB and 18 dB of image rejection across the frequency band. The HMC570LC5 utilizes an LNA followed by an image reject mixer which is driven by an active x2 multiplier. The image reject mixer eliminates the need for a filter following the LNA, and removes thermal noise at the image frequency.I and Q mixer outputs are provided and an external 90° hybrid is needed to select the required sideband. The HMC570LC5 is a much smaller alternative to hybrid style image reject mixer downconverter assemblies, and it eliminates the need for wire bonding by allowing the use of surface mount manufacturing techniques.APPLICATIONSPoint-to-PointPoint-to-Multi-Point RadioMilitary Radar, EW & ELINTSatellite Communications

The HMC570LC5 is a compact GaAs MMIC I/Q downconverter in a leadless RoHS compliant SMT package. This device provides a small signal conversion gain of 10 dB with a noise figure of 3 dB and 18 dB of image rejection across the frequency band. The HMC570LC5 utilizes an LNA followed by an image reject mixer which is driven by an active x2 multiplier. The image reject mixer eliminates the need for a filter following the LNA, and removes thermal noise at the image frequency.I and Q mixer outputs are provided and an external 90° hybrid is needed to select the required sideband. The HMC570LC5 is a much smaller alternative to hybrid style image reject mixer downconverter assemblies, and it eliminates the need for wire bonding by allowing the use of surface mount manufacturing techniques.APPLICATIONSPoint-to-PointPoint-to-Multi-Point RadioMilitary Radar, EW & ELINTSatellite Communications

The HMC571 is a compact GaAs MMIC I/Q downconverter chip which provides a small signal conversion gain of 10 dB with a noise figure of 3 dB and 24 dB of image rejection across the frequency band. The device utilizes an LNA followed by an image reject mixer which is driven by an active x2 multiplier. The image reject mixer eliminates the need for a filter following the LNA, and removes thermal noise at the image frequency.I and Q mixer outputs are provided and an external 90° hybrid is needed to select the required sideband. All data shown below is taken with the chip mounted in a 50 Ohm test fixture and includes the effects of 1 mil diameter × 20 mil length bond wires on each port. This product is a much smaller alternative to hybrid style image reject mixer downconverter assemblies.APPLICATIONSPoint-to-PointPoint-to-Multi-Point RadioMilitary Radar, EW & ELINTSatellite Communications

The HMC571LC5 is a compact GaAs MMIC I/Q downconverter in a leadless RoHS compliant SMT package. This device provides a small signal conversion gain of 9 dB with a noise figure of 3.5 dB and 18 dB of image rejection across the frequency band. The HMC571LC5 utilizes an LNA followed by an image reject mixer which is driven by an active x2 multiplier. The image reject mixer eliminates the need for a filter following the LNA, and removes thermal noise at the image frequency.I and Q mixer outputs are provided and an external 90° hybrid is needed to select the required sideband. The HMC571LC5 is a much smaller alternative to hybrid style image reject mixer downconverter assemblies, and it eliminates the need for wire bonding by allowing the use of surface mount manufacturing techniques.APPLICATIONSPoint-to-PointPoint-to-Multi-Point RadioMilitary Radar, EW & ELINTSatellite Communications