SN74LVTH574-EP Series

Enhanced Product 3.3-V Abt Octal Edge-Triggered D-Type Flip-Flops With 3-State Outputs

Catalog

Enhanced Product 3.3-V Abt Octal Edge-Triggered D-Type Flip-Flops With 3-State Outputs

Part	Max Propagation Delay @ V, Max CL	Output Type	Number of Elements	Mounting Type	Operating Temperature [Max]	Operating Temperature [Min]	Trigger Type	Current - Quiescent (Iq)	Supplier Device Package	Current - Output High, Low [custom]	Current - Output High, Low [custom]	Function	Input Capacitance	Package / Case [y]	Package / Case	Package / Case [x]	Clock Frequency	Voltage - Supply [Min]	Voltage - Supply [Max]	Number of Bits per Element	Type	Package / Case [y]	Package / Case	Package / Case
Texas Instruments SN74LVTH574IPWREP	4.5 ns	Non-Inverted Tri-State	1	Surface Mount	85 °C	-40 °C	Positive Edge	190 çA	20-TSSOP	64 mA	32 mA	Standard	3 pF	4.4 mm	20-TSSOP	0.173 in	150 MHz	2.7 V	3.6 V	8	D-Type
Texas Instruments SN74LVTH574DBR	4.5 ns	Non-Inverted Tri-State	1	Surface Mount	85 °C	-40 °C	Positive Edge	190 çA	20-SSOP	64 mA	32 mA	Standard	3 pF		20-SSOP		150 MHz	2.7 V	3.6 V	8	D-Type
Texas Instruments SN74LVTH574DB	4.5 ns	Non-Inverted Tri-State	1	Surface Mount	85 °C	-40 °C	Positive Edge	190 çA	20-SSOP	64 mA	32 mA	Standard	3 pF		20-SSOP		150 MHz	2.7 V	3.6 V	8	D-Type
Texas Instruments SN74LVTH574DWR	4.5 ns	Non-Inverted Tri-State	1	Surface Mount	85 °C	-40 °C	Positive Edge	190 çA	20-SOIC	64 mA	32 mA	Standard	3 pF	0.295 in	20-SOIC		150 MHz	2.7 V	3.6 V	8	D-Type	7.5 mm
Texas Instruments SN74LVTH574ZQNR	4.5 ns	Non-Inverted Tri-State	1	Surface Mount	85 °C	-40 °C	Positive Edge	190 çA	20-BGA MICROSTAR JUNIOR (4x3)	64 mA	32 mA	Standard	3 pF		20-VFBGA		150 MHz	2.7 V	3.6 V	8	D-Type
Texas Instruments SN74LVTH574PWR	4.5 ns	Non-Inverted Tri-State	1	Surface Mount	85 °C	-40 °C	Positive Edge	190 çA	20-TSSOP	64 mA	32 mA	Standard	3 pF	4.4 mm	20-TSSOP	0.173 in	150 MHz	2.7 V	3.6 V	8	D-Type
Texas Instruments SN74LVTH574DW	4.5 ns	Non-Inverted Tri-State	1	Surface Mount	85 °C	-40 °C	Positive Edge	190 çA	20-SOIC	64 mA	32 mA	Standard	3 pF	0.295 in	20-SOIC		150 MHz	2.7 V	3.6 V	8	D-Type	7.5 mm
Texas Instruments SN74LVTH574PW	4.5 ns	Non-Inverted Tri-State	1	Surface Mount	85 °C	-40 °C	Positive Edge	190 çA	20-TSSOP	64 mA	32 mA	Standard	3 pF	4.4 mm	20-TSSOP	0.173 in	150 MHz	2.7 V	3.6 V	8	D-Type
Texas Instruments SN74LVTH574PWRG4	4.5 ns	Non-Inverted Tri-State	1	Surface Mount	85 °C	-40 °C	Positive Edge	190 çA	20-TSSOP	64 mA	32 mA	Standard	3 pF	4.4 mm	20-TSSOP	0.173 in	150 MHz	2.7 V	3.6 V	8	D-Type
Texas Instruments SN74LVTH574NSR	4.5 ns	Non-Inverted Tri-State	1	Surface Mount	85 °C	-40 °C	Positive Edge	190 çA	20-SO	64 mA	32 mA	Standard	3 pF		20-SOIC		150 MHz	2.7 V	3.6 V	8	D-Type		0.209 "	5.3 mm

Catalog

Enhanced Product 3.3-V Abt Octal Edge-Triggered D-Type Flip-Flops With 3-State Outputs

Key Features

• Controlled BaselineOne Assembly/Test Site, One Fabrication SiteEnhanced Diminishing Manufacturing Sources (DMS) SupportEnhanced Product-Change NotificationQualification PedigreeSupports Mixed-Mode Signal Operation (5-V Input and Output Voltages With 3.3-V VCC)Supports Unregulated Battery Operation Down to 2.7 VTypical VOLP(Output Ground Bounce)<0.8 V at VCC= 3.3 V, TA= 25°CIoffand Power-Up 3-State Support Hot InsertionBus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown ResistorsLatch-Up Performance Exceeds 500 mA Per JESD 17ESD Protection Exceeds JESD 222000-V Human-Body Model (A114-A)200-V Machine Model (A115-A)Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.Controlled BaselineOne Assembly/Test Site, One Fabrication SiteEnhanced Diminishing Manufacturing Sources (DMS) SupportEnhanced Product-Change NotificationQualification PedigreeSupports Mixed-Mode Signal Operation (5-V Input and Output Voltages With 3.3-V VCC)Supports Unregulated Battery Operation Down to 2.7 VTypical VOLP(Output Ground Bounce)<0.8 V at VCC= 3.3 V, TA= 25°CIoffand Power-Up 3-State Support Hot InsertionBus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown ResistorsLatch-Up Performance Exceeds 500 mA Per JESD 17ESD Protection Exceeds JESD 222000-V Human-Body Model (A114-A)200-V Machine Model (A115-A)Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.

Description

These octal flip-flops are designed specifically for low-voltage (3.3-V) VCCoperation, but with the capability to provide a TTL interface to a 5-V system environment. The eight flip-flops of the ’LVTH574 devices are edge-triggered D-type flip-flops. On the positive transition of the clock (CLK) input, the Q outputs are set to the logic levels set up at the data (D) inputs. A buffered output-enable (OE\) input can be used to place the eight outputs in either a normal logic state (high or low logic levels) or a high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus lines without need for interface or pullup components. OE\ does not affect the internal operations of the flip-flops. Old data can be retained or new data can be entered while the outputs are in the high-impedance state. To ensure the high-impedance state during power up or power down, OE\ should be tied to VCCthrough a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level. Use of pullup or pulldown resistors with the bus-hold circuitry is not recommended. These devices are fully specified for hot-insertion applications using Ioffand power-up 3-state. The Ioffcircuitry disables the outputs, preventing damaging current backflow through the devices when they are powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict. These octal flip-flops are designed specifically for low-voltage (3.3-V) VCCoperation, but with the capability to provide a TTL interface to a 5-V system environment. The eight flip-flops of the ’LVTH574 devices are edge-triggered D-type flip-flops. On the positive transition of the clock (CLK) input, the Q outputs are set to the logic levels set up at the data (D) inputs. A buffered output-enable (OE\) input can be used to place the eight outputs in either a normal logic state (high or low logic levels) or a high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus lines without need for interface or pullup components. OE\ does not affect the internal operations of the flip-flops. Old data can be retained or new data can be entered while the outputs are in the high-impedance state. To ensure the high-impedance state during power up or power down, OE\ should be tied to VCCthrough a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level. Use of pullup or pulldown resistors with the bus-hold circuitry is not recommended. These devices are fully specified for hot-insertion applications using Ioffand power-up 3-state. The Ioffcircuitry disables the outputs, preventing damaging current backflow through the devices when they are powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict.