MSCGLQ50DDU120CTBL2NG-Module Series

1200V, 50A, BL2, Double Dual Common Emitter Trench 4 Fast + mSiC™ Diode Baseplate-less Hybrid Module

Catalog

1200V, 50A, BL2, Double Dual Common Emitter Trench 4 Fast + mSiC™ Diode Baseplate-less Hybrid Module

Part	Mounting Type	Current - Collector (Ic) (Max) [Max]	Configuration	Voltage - Collector Emitter Breakdown (Max) [Max]	Input	Input Capacitance (Cies) @ Vce	Operating Temperature [Min]	Operating Temperature [Max]	Power - Max [Max]	Vce(on) (Max) @ Vge, Ic	Current - Collector Cutoff (Max) [Max]	Package / Case
Microchip Technology MSCGLQ50H120CTBL2NG	Chassis Mount	110 A	Full Bridge	1200 V	Standard	2.77 nF	-55 °C	175 ░C	375 W	2.4 V	25 µA	Module
Microchip Technology MSCGLQ50DDU120CTBL2NG	Chassis Mount	110 A	Full Bridge	1200 V	Standard	2.77 nF	-55 °C	175 ░C	375 W	2.4 V	25 µA	Module
Microchip Technology MSCGLQ75H120CTBL3NG	Chassis Mount	160 A	Full Bridge	1200 V	Standard	4.4 nF	-55 °C	175 ░C	470 W	2.4 V	50 µA	Module
Microchip Technology MSCGLQ200A65TG
Microchip Technology MSCGLQ75DDU120CTBL3NG	Chassis Mount	160 A	Full Bridge	1200 V	Standard	4.4 nF	-55 °C	175 ░C	470 W	2.4 V	50 µA	Module
Microchip Technology MSCGLQ50A120CTBL1NG	Chassis Mount	110 A	Half Bridge	1200 V	Standard	2.77 nF	-55 °C	175 ░C	375 W	2.4 V	25 µA	Module
Microchip Technology MSCGLQ200SK65TG

Catalog

1200V, 50A, BL2, Double Dual Common Emitter Trench 4 Fast + mSiC™ Diode Baseplate-less Hybrid Module

Key Features

- High speed IGBT 4

- Kelvin emitter for easy drive

Description

'• High speed IGBT 4 • Kelvin emitter for easy drive • Very low stray inductance • Ultra low weight and profile • High efficiency converter • Direct mounting to heatsink (isolated package) • Low junction to case thermal resistance • RoHS Compliant