
Catalog
500V FREDFET
| Part | Mounting Type | Input Capacitance (Ciss) (Max) @ Vds | Power Dissipation (Max) [Max] | Supplier Device Package | Package / Case | Operating Temperature [Min] | Operating Temperature [Max] | Gate Charge (Qg) (Max) @ Vgs [Max] | Vgs (Max) | FET Type | Rds On (Max) @ Id, Vgs | Vgs(th) (Max) @ Id | Technology | Drive Voltage (Max Rds On, Min Rds On) | Drain to Source Voltage (Vdss) | Current - Continuous Drain (Id) @ 25°C | Gate Charge (Qg) (Max) @ Vgs | Power Dissipation (Max) | Rds On (Max) @ Id, Vgs [Max] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology | Chassis Mount | 7010 pF | 520 W | ISOTOP® | SOT-227-4 miniBLOC | -55 °C | 150 °C | 141 nC | 30 V | N-Channel | 65 mOhm | 5 V | MOSFET (Metal Oxide) | 10 V | 500 V | 58 A | |||
Microchip Technology | Through Hole | 4440 pF | TO-247 [B] | TO-247-3 | 225 nC | N-Channel | 200 mOhm | MOSFET (Metal Oxide) | 500 V | 26 A | |||||||||
Microchip Technology | Surface Mount | D3PAK | D3PAK (2 Leads + Tab) TO-268-3 TO-268AA | -55 °C | 150 °C | 30 V | N-Channel | 190 mOhm | MOSFET (Metal Oxide) | 10 V | 500 V | 30 A | 115 nC | 415 W | |||||
Microchip Technology | Through Hole | 5280 pF | TO-247 [B] | TO-247-3 | 300 nC | N-Channel | MOSFET (Metal Oxide) | 500 V | 30 A | ||||||||||
Microchip Technology | Through Hole | T-MAX™ [B2] | TO-247-3 Variant | -55 °C | 150 °C | 30 V | N-Channel | 75 mOhm | 5 V | MOSFET (Metal Oxide) | 10 V | 500 V | 75 A | 290 nC | 1040 W | ||||
Microchip Technology | Chassis Mount | 19600 pF | ISOTOP® | SOT-227-4 miniBLOC | 1000 nC | N-Channel | 4 V | MOSFET (Metal Oxide) | 500 V | 77 A | 50 mOhm | ||||||||
Microchip Technology | Surface Mount | 5710 pF | 520 W | D3PAK | D3PAK (2 Leads + Tab) TO-268-3 TO-268AA | -55 °C | 150 °C | 145 nC | 30 V | N-Channel | 150 mOhm | MOSFET (Metal Oxide) | 10 V | 500 V | 37 A | ||||
Microchip Technology | Chassis Mount | 5590 pF | SOT-227 | SOT-227-4 miniBLOC | -55 °C | 150 °C | 123 nC | 30 V | N-Channel | 75 mOhm | MOSFET (Metal Oxide) | 10 V | 500 V | 51 A | 290 W | ||||
Microchip Technology | Through Hole | 5590 pF | TO-264 [L] | TO-264-3 TO-264AA | N-Channel | 75 mOhm | 5 V | MOSFET (Metal Oxide) | 500 V | 57 A | 125 nC | ||||||||
Microchip Technology | Surface Mount | 4440 pF | D3PAK | D3PAK (2 Leads + Tab) TO-268-3 TO-268AA | 225 nC | N-Channel | 200 mOhm | MOSFET (Metal Oxide) | 500 V | 26 A |
Key Features
• * Power Semiconductors, Power Modules and RF Power MOSFETs Catalog
• * Eliminating Parasitic Oscillation between Parallel MOSFETs
• * High Frequency Resonant Half Bridge
• * Improved Power MOSFETS Boost Efficiency IN A 3.5kw Single Phase PFC
• * Introduction to MOSFETs
• * Latest Technology PT IGBTs vs. Power MOSFETs
• * Making Use of Gate Charge Information In MOSFET and IGBT Data Sheets
• * Optimizing MOSFET and IGBT Gate Current to Minimize dv/dt Induced Failures in SMPS Circuits
• * Turn Off Snubber Design for High Frequency Modules
• * VDS(on) VCE(sat) Measurement
Description
AI
Power MOS 8™ is a family of high speed, high voltage (500-1200 V) N-channel
switch-mode power transistors with lower EMI characteristics and lower cost
compared to previous generation devices. These MOSFETs / FREDFETs have been
optimized for both hard and soft switching in high frequency, high voltage
applications rated above 500 W.
The Power MOS 8™ series is a result of extensive research into quiet switching.
Input and reverse transfer capacitance values as well as their ratio were set
at specific values to achieve quiet switching with minimal switching loss. The
Power MOS 8™ series of devices are inherently quiet switching, stable when
connected in parallel, very efficient, and lower cost than previous
generations.
Power MOS 7® is a family of low loss, high voltage, N-Channel enhancement
mode power MOSFETS. Both conduction and switching losses are addressed with
Power MOS 7® by significantly lowering RDS(ON)and Qg. Power MOS 7® combines
lower conduction and switching losses along with exceptionally fast switching
speeds.
Power MOS V® can still provide the best trade-off between performance and
cost in some applications. Power MOS V® utilizes a low resistance aluminum
metal gate structure. This allows for faster gate signal propagation than is
possible with conventional polysilicon gate structures. The result is extremely
low internal chip equivalent gate resistances (EGR) that are up to an order of
magnitude lower than competitive devices which enables uniform high speed
switching across the entire chip.
Body Diode Options
MOSFETs and FREDFETs are available in all voltage ratings. A FREDFET is a
MOSFET with a faster recovery intrinsic body diode. This results in improved
reliability in ZVS circuits due to shorter minority carrier lifetime and
increased commutation dv/dt ruggedness. If a fast recovery body diode is not
needed, MOSFET versions are available.