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FREDFET-500V

FREDFET-500V Series

500V FREDFET

Manufacturer: Microchip Technology

Catalog

500V FREDFET

PartMounting TypeInput Capacitance (Ciss) (Max) @ VdsPower Dissipation (Max) [Max]Supplier Device PackagePackage / CaseOperating Temperature [Min]Operating Temperature [Max]Gate Charge (Qg) (Max) @ Vgs [Max]Vgs (Max)FET TypeRds On (Max) @ Id, VgsVgs(th) (Max) @ IdTechnologyDrive Voltage (Max Rds On, Min Rds On)Drain to Source Voltage (Vdss)Current - Continuous Drain (Id) @ 25°CGate Charge (Qg) (Max) @ VgsPower Dissipation (Max)Rds On (Max) @ Id, Vgs [Max]
SOT-227-4, miniBLOC
Microchip Technology
Chassis Mount
7010 pF
520 W
ISOTOP®
SOT-227-4
miniBLOC
-55 °C
150 °C
141 nC
30 V
N-Channel
65 mOhm
5 V
MOSFET (Metal Oxide)
10 V
500 V
58 A
TO-247-3-PKG-Series
Microchip Technology
Through Hole
4440 pF
TO-247 [B]
TO-247-3
225 nC
N-Channel
200 mOhm
MOSFET (Metal Oxide)
500 V
26 A
D3PAK
Microchip Technology
Surface Mount
D3PAK
D3PAK (2 Leads + Tab)
TO-268-3
TO-268AA
-55 °C
150 °C
30 V
N-Channel
190 mOhm
MOSFET (Metal Oxide)
10 V
500 V
30 A
115 nC
415 W
TO-247-3-PKG-Series
Microchip Technology
Through Hole
5280 pF
TO-247 [B]
TO-247-3
300 nC
N-Channel
MOSFET (Metal Oxide)
500 V
30 A
T-MAX Pkg
Microchip Technology
Through Hole
T-MAX™ [B2]
TO-247-3 Variant
-55 °C
150 °C
30 V
N-Channel
75 mOhm
5 V
MOSFET (Metal Oxide)
10 V
500 V
75 A
290 nC
1040 W
SOT-227-4,-miniBLOC
Microchip Technology
Chassis Mount
19600 pF
ISOTOP®
SOT-227-4
miniBLOC
1000 nC
N-Channel
4 V
MOSFET (Metal Oxide)
500 V
77 A
50 mOhm
D3PAK
Microchip Technology
Surface Mount
5710 pF
520 W
D3PAK
D3PAK (2 Leads + Tab)
TO-268-3
TO-268AA
-55 °C
150 °C
145 nC
30 V
N-Channel
150 mOhm
MOSFET (Metal Oxide)
10 V
500 V
37 A
SOT-227-4, miniBLOC
Microchip Technology
Chassis Mount
5590 pF
SOT-227
SOT-227-4
miniBLOC
-55 °C
150 °C
123 nC
30 V
N-Channel
75 mOhm
MOSFET (Metal Oxide)
10 V
500 V
51 A
290 W
TO-264 PKG
Microchip Technology
Through Hole
5590 pF
TO-264 [L]
TO-264-3
TO-264AA
N-Channel
75 mOhm
5 V
MOSFET (Metal Oxide)
500 V
57 A
125 nC
MSC060SMA070S
Microchip Technology
Surface Mount
4440 pF
D3PAK
D3PAK (2 Leads + Tab)
TO-268-3
TO-268AA
225 nC
N-Channel
200 mOhm
MOSFET (Metal Oxide)
500 V
26 A

Key Features

* Power Semiconductors, Power Modules and RF Power MOSFETs Catalog
* Eliminating Parasitic Oscillation between Parallel MOSFETs
* High Frequency Resonant Half Bridge
* Improved Power MOSFETS Boost Efficiency IN A 3.5kw Single Phase PFC
* Introduction to MOSFETs
* Latest Technology PT IGBTs vs. Power MOSFETs
* Making Use of Gate Charge Information In MOSFET and IGBT Data Sheets
* Optimizing MOSFET and IGBT Gate Current to Minimize dv/dt Induced Failures in SMPS Circuits
* Turn Off Snubber Design for High Frequency Modules
* VDS(on) VCE(sat) Measurement

Description

AI
Power MOS 8™ is a family of high speed, high voltage (500-1200 V) N-channel switch-mode power transistors with lower EMI characteristics and lower cost compared to previous generation devices. These MOSFETs / FREDFETs have been optimized for both hard and soft switching in high frequency, high voltage applications rated above 500 W. The Power MOS 8™ series is a result of extensive research into quiet switching. Input and reverse transfer capacitance values as well as their ratio were set at specific values to achieve quiet switching with minimal switching loss. The Power MOS 8™ series of devices are inherently quiet switching, stable when connected in parallel, very efficient, and lower cost than previous generations. Power MOS 7® is a family of low loss, high voltage, N-Channel enhancement mode power MOSFETS. Both conduction and switching losses are addressed with Power MOS 7® by significantly lowering RDS(ON)and Qg. Power MOS 7® combines lower conduction and switching losses along with exceptionally fast switching speeds. Power MOS V® can still provide the best trade-off between performance and cost in some applications. Power MOS V® utilizes a low resistance aluminum metal gate structure. This allows for faster gate signal propagation than is possible with conventional polysilicon gate structures. The result is extremely low internal chip equivalent gate resistances (EGR) that are up to an order of magnitude lower than competitive devices which enables uniform high speed switching across the entire chip. Body Diode Options MOSFETs and FREDFETs are available in all voltage ratings. A FREDFET is a MOSFET with a faster recovery intrinsic body diode. This results in improved reliability in ZVS circuits due to shorter minority carrier lifetime and increased commutation dv/dt ruggedness. If a fast recovery body diode is not needed, MOSFET versions are available.