LMG3422R030 Series
600-V 30-mΩ GaN FET with integrated driver, protection and temperature reporting
Manufacturer: Texas Instruments
Catalog
600-V 30-mΩ GaN FET with integrated driver, protection and temperature reporting
Key Features
• Qualified for JEDEC JEP180 for hard-switching topologies600V GaN-on-Si FET with integrated gate driverIntegrated high precision gate bias voltage200V/ns FET hold-off2.2MHz switching frequency20V/ns to 150V/ns slew rate for optimization of switching performance and EMI mitigationOperates from 7.5V to 18V supplyRobust protectionCycle-by-cycle overcurrent and latched short-circuit protection with < 100ns responseWithstands 720V surge while hard-switchingSelf-protection from internal overtemperature and UVLO monitoringAdvanced power managementDigital temperature PWM outputLMG3426R030 includes zero-voltage detection (ZVD) feature that facilitates soft-switching convertersLMG3427R030 includes zero-current detection (ZCD) feature that facilitates soft-switching convertersQualified for JEDEC JEP180 for hard-switching topologies600V GaN-on-Si FET with integrated gate driverIntegrated high precision gate bias voltage200V/ns FET hold-off2.2MHz switching frequency20V/ns to 150V/ns slew rate for optimization of switching performance and EMI mitigationOperates from 7.5V to 18V supplyRobust protectionCycle-by-cycle overcurrent and latched short-circuit protection with < 100ns responseWithstands 720V surge while hard-switchingSelf-protection from internal overtemperature and UVLO monitoringAdvanced power managementDigital temperature PWM outputLMG3426R030 includes zero-voltage detection (ZVD) feature that facilitates soft-switching convertersLMG3427R030 includes zero-current detection (ZCD) feature that facilitates soft-switching converters
Description
AI
The LMG342xR030 GaN FET with integrated driver and protection is targeted at switch-mode power converters and enables designers to achieve new levels of power density and efficiency.
The LMG342xR030 integrates a silicon driver that enables switching speed up to 150V/ns. TI’s integrated precision gate bias results in higher switching SOA compared to discrete silicon gate drivers. This integration, combined with TI’s low-inductance package, delivers clean switching and minimal ringing in hard-switching power supply topologies. Adjustable gate drive strength allows control of the slew rate from 20V/ns to 150V/ns, which can be used to actively control EMI and optimize switching performance. The LMG3426R030 includes the zero-voltage detection (ZVD) feature which provides a pulse output from the ZVD pin when zero-voltage switching is realized.The LMG3427R030 includes the zero-current detection (ZCD) feature which provides a pulse output from the ZCD pin when a positive drain-to-source current is detected .
Advanced power management features include digital temperature reporting and fault detection. The temperature of the GaN FET is reported through a variable duty cycle PWM output, which simplifies managing device loading. Faults reported include overcurrent, short-circuit, overtemperature, VDD UVLO, and high-impedance RDRV pin.
The LMG342xR030 GaN FET with integrated driver and protection is targeted at switch-mode power converters and enables designers to achieve new levels of power density and efficiency.
The LMG342xR030 integrates a silicon driver that enables switching speed up to 150V/ns. TI’s integrated precision gate bias results in higher switching SOA compared to discrete silicon gate drivers. This integration, combined with TI’s low-inductance package, delivers clean switching and minimal ringing in hard-switching power supply topologies. Adjustable gate drive strength allows control of the slew rate from 20V/ns to 150V/ns, which can be used to actively control EMI and optimize switching performance. The LMG3426R030 includes the zero-voltage detection (ZVD) feature which provides a pulse output from the ZVD pin when zero-voltage switching is realized.The LMG3427R030 includes the zero-current detection (ZCD) feature which provides a pulse output from the ZCD pin when a positive drain-to-source current is detected .
Advanced power management features include digital temperature reporting and fault detection. The temperature of the GaN FET is reported through a variable duty cycle PWM output, which simplifies managing device loading. Faults reported include overcurrent, short-circuit, overtemperature, VDD UVLO, and high-impedance RDRV pin.