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Discrete Semiconductor Products

RJ1G10BBGTL1

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Rohm Semiconductor

NCH 40V 280A, TO-263AB, POWER MOSFET

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Product thumbnail image
Discrete Semiconductor Products

RJ1G10BBGTL1

Active
Rohm Semiconductor

NCH 40V 280A, TO-263AB, POWER MOSFET

Technical Specifications

Parameters and characteristics for this part

SpecificationRJ1G10BBGTL1
Current - Continuous Drain (Id) @ 25°C105 A
Drain to Source Voltage (Vdss)40 V
Drive Voltage (Max Rds On, Min Rds On)10 V, 4.5 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs210 nC
Input Capacitance (Ciss) (Max) @ Vds [Max]13200 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseD2PAK (2 Leads + Tab), TO-263-3, TO-263AB
Power Dissipation (Max)192 W
Rds On (Max) @ Id, Vgs1.43 mOhm
Supplier Device PackageTO-263AB
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max) @ Id2.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 0$ 6.76

Description

General part information

RJ1G10BBG Series

RJ1G10BBG is a power MOSFET with low on-resistance and high power package, suitable for switching, motor drives, and DC/DC converter.

Documents

Technical documentation and resources

Method for Monitoring Switching Waveform

Schematic Design & Verification

Compliance of the RoHS directive

Environmental Data

Two-Resistor Model for Thermal Simulation

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

RJ1G10BBG Data Sheet

Data Sheet

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Part Explanation

Application Note

What Is Thermal Design

Thermal Design

About Flammability of Materials

Environmental Data

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Types and Features of Transistors

Application Note

Anti-Whisker formation - Transistors

Package Information

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

RJ1G10BBG ESD Data

Characteristics Data

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

What is a Thermal Model? (Transistor)

Thermal Design

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

How to Use LTspice® Models

Schematic Design & Verification

Notes for Calculating Power Consumption:Static Operation

Thermal Design

About Export Regulations

Export Information

List of Transistor Package Thermal Resistance

Thermal Design

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Moisture Sensitivity Level - Transistors

Package Information

MOSFET Gate Resistor Setting for Motor Driving

Technical Article