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676 FBBGA
Integrated Circuits (ICs)

M2GL060TS-FG676

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Microchip Technology

IGLOO2 LOW DENSITY FPGA, 56.5KLES 676 PBGA 27X27X2.44MM TRAY ROHS COMPLIANT: YES

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676 FBBGA
Integrated Circuits (ICs)

M2GL060TS-FG676

Active
Microchip Technology

IGLOO2 LOW DENSITY FPGA, 56.5KLES 676 PBGA 27X27X2.44MM TRAY ROHS COMPLIANT: YES

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationM2GL060TS-FG676
Mounting TypeSurface Mount
Number of I/O387
Number of Logic Elements/Cells56520
Operating Temperature [Max]85 °C
Operating Temperature [Min]0 °C
Package / Case676-BGA
Supplier Device Package676-FBGA (27x27)
Total RAM Bits1869824
Voltage - Supply [Max]2.625 V
Voltage - Supply [Min]1.14 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTray 40$ 134.04
Microchip DirectTRAY 1$ 143.62
5$ 139.64
10$ 135.86
25$ 134.04
50$ 132.28
100$ 130.57
250$ 127.26
500$ 121.13
1000$ 77.93
5000$ 70.30
NewarkEach 25$ 134.04
50$ 132.28
100$ 130.57
250$ 127.26
500$ 121.13

Description

General part information

M2GL060TS Series

These flash FPGA devices are ideal for general purpose functions such as Gigabit Ethernet or dual PCI Express control planes, bridging functions, input/output (I/O) expansion and conversion, video/image processing, system management and secure connectivity. Microchip FPGAs are used by customers in Communications, Industrial, Medical, Defense, and Aviation markets.

More Resources in Low Density Devices

* Comprehensive microcontroller subsystem

Documents

Technical documentation and resources