Soldering, Desoldering, Rework Products

SMDLTLFP500T4C

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SOLDER PASTE LOW TEMP T4 500G

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Soldering, Desoldering, Rework Products

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SOLDER PASTE LOW TEMP T4 500G

Technical Specifications

Parameters and characteristics for this part

Specification	SMDLTLFP500T4C

Composition	57.6 %, 42 %, 0.4 %
Flux Type	No-Clean
Form	17.64 oz
Form	500 g
Form	Cartridge
Melting Point	138 °C
Melting Point	281 °F
Mesh Type	4
Shelf Life	6 Months
Shelf Life Start	Date of Manufacture
Shipping Info	Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Type	Solder Paste

Part	Melting Point	Melting Point	Shelf Life Start	Flux Type	Type	Composition	Form	Form	Form	Mesh Type	Shelf Life	Storage/Refrigeration Temperature [Max]	Storage/Refrigeration Temperature [Min]	Storage/Refrigeration Temperature [Min]	Storage/Refrigeration Temperature [Max]	Shipping Info	Shelf Life	Mesh Type
Chip Quik Inc. SMDLTLFP15T4	138 °C	281 °F	Date of Manufacture	No-Clean	Solder Paste Two Part Mix	0.4 % 42 % 57.6 %	15 g	0.53 oz	Jar	4	24 Months	77 °F	3 °C	37 °F	25 °C
Chip Quik Inc. SMDLTLFP500T4C	138 °C	281 °F	Date of Manufacture	No-Clean	Solder Paste	0.4 % 42 % 57.6 %	500 g	17.64 oz	Cartridge	4						Ships with Cold Pack. To ensure customer satisfaction and product integrity air shipment is recommended.	6 Months
Chip Quik Inc. SMDLTLFP500T3C	138 °C	281 °F	Date of Manufacture	No-Clean	Solder Paste	0.4 % 42 % 57.6 %	500 g	17.64 oz	Cartridge							Ships with Cold Pack. To ensure customer satisfaction and product integrity air shipment is recommended.	6 Months	3

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Cartridge, 17.64 oz (500g)

Technical documentation and resources