Specification	SMDLTLFP15T4

Composition	57.6 %, 42 %, 0.4 %
Flux Type	No-Clean
Form	15 g
Form	0.53 oz
Form	Jar
Melting Point	138 °C
Melting Point	281 °F
Mesh Type	4
Shelf Life	24 Months
Shelf Life Start	Date of Manufacture
Storage/Refrigeration Temperature [Max]	77 °F
Storage/Refrigeration Temperature [Max]	25 °C
Storage/Refrigeration Temperature [Min]	3 °C
Storage/Refrigeration Temperature [Min]	37 °F
Type	Solder Paste, Two Part Mix

SMDLTL Series

Part	Melting Point	Melting Point	Shelf Life Start	Flux Type	Type	Composition	Form	Form	Form	Mesh Type	Shelf Life	Storage/Refrigeration Temperature [Max]	Storage/Refrigeration Temperature [Min]	Storage/Refrigeration Temperature [Min]	Storage/Refrigeration Temperature [Max]	Shipping Info	Shelf Life	Mesh Type
Chip Quik Inc. SMDLTLFP15T4	138 °C	281 °F	Date of Manufacture	No-Clean	Solder Paste Two Part Mix	0.4 % 42 % 57.6 %	15 g	0.53 oz	Jar	4	24 Months	77 °F	3 °C	37 °F	25 °C
Chip Quik Inc. SMDLTLFP500T4C	138 °C	281 °F	Date of Manufacture	No-Clean	Solder Paste	0.4 % 42 % 57.6 %	500 g	17.64 oz	Cartridge	4						Ships with Cold Pack. To ensure customer satisfaction and product integrity air shipment is recommended.	6 Months
Chip Quik Inc. SMDLTLFP500T3C	138 °C	281 °F	Date of Manufacture	No-Clean	Solder Paste	0.4 % 42 % 57.6 %	500 g	17.64 oz	Cartridge							Ships with Cold Pack. To ensure customer satisfaction and product integrity air shipment is recommended.	6 Months	3

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

Lead Free No-Clean Solder Paste, Two Part Mix Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar, 0.53 oz (15g)

Technical documentation and resources