Integrated Circuits (ICs)

A3P600-FG256

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FPGA PROASIC3 FAMILY 600K GATES 231MHZ 130NM (CMOS) TECHNOLOGY 1.5V 256-PIN FBGA

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Integrated Circuits (ICs)

Active

FPGA PROASIC3 FAMILY 600K GATES 231MHZ 130NM (CMOS) TECHNOLOGY 1.5V 256-PIN FBGA

Technical Specifications

Parameters and characteristics for this part

Ultra Low Density FPGAs

Part	Voltage - Supply [Max]	Voltage - Supply [Min]	Mounting Type	Package / Case	Operating Temperature [Min]	Operating Temperature [Max]	Number of I/O	Number of Gates	Total RAM Bits	Supplier Device Package
Microchip Technology A3P600-1PQG208	1.575 V	1.425 V	Surface Mount	208-BFQFP	0 °C	85 °C	154	600000	110592 bits	208-PQFP (28x28)
Microchip Technology A3P600-1PQ208I	1.575 V	1.425 V	Surface Mount	208-BFQFP	-40 C	100 °C	154	600000	110592 bits	208-PQFP (28x28)
Microchip Technology A3P600-1FGG256I	1.575 V	1.425 V	Surface Mount	256-LBGA	-40 C	100 °C	177	600000	110592 bits	256-FPBGA (17x17)
Microchip Technology A3P600-FGG256	1.575 V	1.425 V	Surface Mount	256-LBGA	0 °C	85 °C	177	600000	110592 bits	256-FPBGA (17x17)
Microchip Technology A3P600-1FG144	1.575 V	1.425 V	Surface Mount	144-LBGA	0 °C	85 °C	97	600000	110592 bits	13x13 144-FPBGA
Microchip Technology A3P600L-FGG144I	1.575 V	1.14 V	Surface Mount	144-LBGA	-40 C	100 °C	97	600000	110592 bits	13x13 144-FPBGA
Microchip Technology A3P600-FG256	1.575 V	1.425 V	Surface Mount	256-LBGA	0 °C	85 °C	177	600000	110592 bits	256-FPBGA (17x17)
Microchip Technology A3P600-PQG208	1.575 V	1.425 V	Surface Mount	208-BFQFP	0 °C	85 °C	154	600000	110592 bits	208-PQFP (28x28)
Microchip Technology A3P600L-1FG144	1.575 V	1.14 V	Surface Mount	144-LBGA	0 °C	85 °C	97	600000	110592 bits	13x13 144-FPBGA
Microchip Technology A3P600-PQG208I	1.575 V	1.425 V	Surface Mount	208-BFQFP	-40 C	100 °C	154	600000	110592 bits	208-PQFP (28x28)

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

ProASIC3

offers high performance in ultra low density FPGAs, a single-chip solution,

small footprint packages, reprogrammability, and an abundance of advanced

Technical documentation and resources