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Discrete Semiconductor Products

RGW40TK65DGVC11

Active
Rohm Semiconductor

HIGH-SPEED FAST SWITCHING TYPE, 650V 16A, FRD BUILT-IN, TO-3PFM, FIELD STOP TRENCH IGBT

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Product thumbnail image
Discrete Semiconductor Products

RGW40TK65DGVC11

Active
Rohm Semiconductor

HIGH-SPEED FAST SWITCHING TYPE, 650V 16A, FRD BUILT-IN, TO-3PFM, FIELD STOP TRENCH IGBT

Technical Specifications

Parameters and characteristics for this part

SpecificationRGW40TK65DGVC11
Current - Collector (Ic) (Max) [Max]27 A
Current - Collector Pulsed (Icm)80 A
Gate Charge59 nC
IGBT TypeTrench Field Stop
Mounting TypeThrough Hole
Operating Temperature [Max]175 °C
Operating Temperature [Min]-40 C
Package / CaseTO-3PFM, SC-93-3
Power - Max [Max]61 W
Reverse Recovery Time (trr)92 ns
Supplier Device PackageTO-3PFM
Td (on/off) @ 25°C33 ns, 76 ns
Test Condition20 A, 400 V, 15 V, 10 Ohm
Vce(on) (Max) @ Vge, Ic1.9 V
Voltage - Collector Emitter Breakdown (Max)650 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTube 1$ 7.01
30$ 4.03
120$ 3.37
510$ 2.88
1020$ 2.85

Description

General part information

RGW40TK65D Series

RGW40TK65D is a high speed switching IGBT, suitable for PFC, Solar Inverter, UPS, Welding, IH applications.

Documents

Technical documentation and resources

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

About Export Administration Regulations (EAR)

Export Information

Method for Monitoring Switching Waveform

Schematic Design & Verification

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

4 Steps for Successful Thermal Designing of Power Devices

White Paper

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Moisture Sensitivity Level

Package Information

The Problem with Traditional Vaccine Storage Freezers and How ROHM Cutting-edge Power Solutions Can Take them to the Next Level

White Paper

PCB Layout Thermal Design Guide

Thermal Design

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

Anti-Whisker formation

Package Information

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

About Flammability of Materials

Environmental Data

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Types and Features of Transistors

Application Note

Generation Mechanism of Voltage Surge on Commutation Side (Basic)

Technical Article

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

What Is Thermal Design

Thermal Design

Package Dimensions

Package Information

Compliance of the ELV directive

Environmental Data

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Semikron Danfoss: Partnering for the Safe Supply of Industrial Power Modules

White Paper

Two-Resistor Model for Thermal Simulation

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design