PIC16F15254-I/SO
Active7KB FLASH, 512B RAM, 10B ADC, 2XPWM, 2XCCP, HLT, WDT, PPS, EUSART, SPI/I2C, XLP 28 SOIC .300IN TUBE ROHS COMPLIANT: YES
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PIC16F15254-I/SO
Active7KB FLASH, 512B RAM, 10B ADC, 2XPWM, 2XCCP, HLT, WDT, PPS, EUSART, SPI/I2C, XLP 28 SOIC .300IN TUBE ROHS COMPLIANT: YES
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Technical Specifications
Parameters and characteristics for this part
| Specification | PIC16F15254-I/SO |
|---|---|
| Connectivity | I2C, LINbus, UART/USART, SPI |
| Core Processor | PIC |
| Core Size | 8-Bit |
| Data Converters [custom] | 19 |
| Data Converters [custom] | 10 b |
| Mounting Type | Surface Mount |
| Number of I/O | 24 |
| Operating Temperature [Max] | 85 °C |
| Operating Temperature [Min] | -40 °C |
| Oscillator Type | Internal |
| Package / Case | 28-SOIC |
| Package / Case [x] | 0.295 in |
| Package / Case [y] | 7.5 mm |
| Program Memory Size | 7 KB |
| Program Memory Type | FLASH |
| RAM Size | 512 |
| Speed | 32 MHz |
| Supplier Device Package | 28-SOIC |
| Voltage - Supply (Vcc/Vdd) [Max] | 5.5 V |
| Voltage - Supply (Vcc/Vdd) [Min] | 1.8 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Tube | 1 | $ 0.99 | |
| 25 | $ 0.91 | |||
| 100 | $ 0.82 | |||
| Microchip Direct | TUBE | 1 | $ 0.84 | |
| 25 | $ 0.77 | |||
| 100 | $ 0.69 | |||
| 1000 | $ 0.64 | |||
| 5000 | $ 0.61 | |||
| Newark | Each | 100 | $ 0.62 | |
Description
General part information
PIC16F15254 Series
[***Code Examples on GitHub***](https://github.com/orgs/microchip-pic-avr-examples/repositories?q=PIC16F152&type=all&language=&sort=)
The PIC16F152xx 8-bit product family features an essential peripheral set including key Core Independent Peripherals (CIPs), Intelligent Analog, and standard communication modules. Paired with it's ability for eXtreme Low-Power, this family is particularly well-suited for a wide range of low-power applications. Included in the feature set are multiple PWMs, various communication peripherals, an internal temperature sensor, and memory features like a Memory Access Partition (MAP) and Device Information Area (DIA). These product will be offered in a broad selection of packages and pin counts from 8 to 44(40)-pins, to support customers in a variety of applications.
Documents
Technical documentation and resources
