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8 SOIC
Integrated Circuits (ICs)

LMV358IDR2G

Active
ON Semiconductor

OPERATIONAL AMPLIFIER, 2 CHANNELS, 1 MHZ, 1 V/ΜS, 2.7V TO 5V, SOIC, 8 PINS

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8 SOIC
Integrated Circuits (ICs)

LMV358IDR2G

Active
ON Semiconductor

OPERATIONAL AMPLIFIER, 2 CHANNELS, 1 MHZ, 1 V/ΜS, 2.7V TO 5V, SOIC, 8 PINS

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationLMV358IDR2G
Amplifier TypeCMOS
Current - Input Bias1 nA
Current - Output / Channel [custom]160 mA
Current - Supply210 µA
Gain Bandwidth Product1 MHz
Mounting TypeSurface Mount
Number of Circuits2
Operating Temperature [Max]85 °C
Operating Temperature [Min]-40 °C
Output TypeRail-to-Rail
Package / Case8-SOIC
Package / Case [x]0.154 in
Package / Case [y]3.9 mm
Slew Rate1 V/µs
Supplier Device Package8-SOIC
Voltage - Input Offset1.7 mV
Voltage - Supply Span (Max) [Max]5.5 V
Voltage - Supply Span (Min) [Min]2.7 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.62
10$ 0.53
25$ 0.50
100$ 0.37
250$ 0.31
500$ 0.30
1000$ 0.22
Digi-Reel® 1$ 0.62
10$ 0.53
25$ 0.50
100$ 0.37
250$ 0.31
500$ 0.30
1000$ 0.22
Tape & Reel (TR) 2500$ 0.21
5000$ 0.19
12500$ 0.18
25000$ 0.18
NewarkEach 2500$ 0.19
10000$ 0.18
ON SemiconductorN/A 1$ 0.16

Description

General part information

LMV358 Series

The LMV321, LMV358, and LMV324 are single, dual, and quad low voltage op-amps with rail-to-rail output swing. These amplifiers are a cost-effective solution for applications where low power consumption and space saving packages are critical. Specification tables are provided for operation from power supply voltages at 2.7 V and 5 V. Rail-to-Rail operation allows for optimal signal-to-noise applications. Ultra low quiescent current makes this series of amplifiers ideal for portable, battery operated equipment. The common mode input range includes ground making the device useful for low-side current-shunt measurements. The ultra small packages allow for placement on the PCB in close proximity to the signal source thereby reducing noise pickup.