LMV358 Series

Operational Amplifier, Low Power, Rail to Rail Output, CMOS Op-Amp

Catalog

Operational Amplifier, Low Power, Rail to Rail Output, CMOS Op-Amp

Part	Amplifier Type	Current - Supply	Voltage - Supply Span (Max) [Max]	Voltage - Input Offset	Number of Circuits	Voltage - Supply Span (Min) [Min]	Gain Bandwidth Product	Current - Output / Channel [custom]	Operating Temperature [Max]	Operating Temperature [Min]	Output Type	Slew Rate	Mounting Type	Current - Input Bias	Supplier Device Package	Package / Case	Package / Case [y]	Package / Case [x]	Package / Case [custom]	Package / Case
ON Semiconductor LMV358DR2G	Voltage Feedback	100 µA	5.5 V	1.7 mV	2	2.7 V	1 MHz	160 mA	85 °C	-40 °C	Rail-to-Rail	1 V/µs	Surface Mount	1 nA	8-SOIC	8-SOIC	3.9 mm	0.154 in
ON Semiconductor LMV358DMR2G	Voltage Feedback	100 µA	5.5 V	1.7 mV	2	2.7 V	1 MHz	160 mA	85 °C	-40 °C	Rail-to-Rail	1 V/µs	Surface Mount	1 nA	8-MSOP	8-MSOP 8-TSSOP			0.118 in	3 mm
ON Semiconductor LMV358IDR2G	CMOS	210 µA	5.5 V	1.7 mV	2	2.7 V	1 MHz	160 mA	85 °C	-40 °C	Rail-to-Rail	1 V/µs	Surface Mount	1 nA	8-SOIC	8-SOIC	3.9 mm	0.154 in

Catalog

Operational Amplifier, Low Power, Rail to Rail Output, CMOS Op-Amp

Key Features

• Operation from 2.7 V to 5.0 V Single-Sided Power Supply

• No Output Crossover Distortion

• Industrial temperature Range: -40C to +85C

• Rail-to-Rail Output

• Low Quiescent Current

• No Output Phase-Reversal from Overdriven Input

Description

The LMV321, LMV358, and LMV324 are single, dual, and quad low voltage op-amps with rail-to-rail output swing. These amplifiers are a cost-effective solution for applications where low power consumption and space saving packages are critical. Specification tables are provided for operation from power supply voltages at 2.7 V and 5 V. Rail-to-Rail operation allows for optimal signal-to-noise applications. Ultra low quiescent current makes this series of amplifiers ideal for portable, battery operated equipment. The common mode input range includes ground making the device useful for low-side current-shunt measurements. The ultra small packages allow for placement on the PCB in close proximity to the signal source thereby reducing noise pickup.