Zenode.ai Logo
Beta
TFBGA / 324
Integrated Circuits (ICs)

AT91SAM9263B-CU-999

Obsolete
Microchip Technology

IC MPU AT91SAM 200MHZ 324TFBGA

Deep-Dive with AI

Search across all available documentation for this part.

TFBGA / 324
Integrated Circuits (ICs)

AT91SAM9263B-CU-999

Obsolete
Microchip Technology

IC MPU AT91SAM 200MHZ 324TFBGA

Technical Specifications

Parameters and characteristics for this part

SpecificationAT91SAM9263B-CU-999
Additional InterfacesMMC/SD/SDIO, SSC, SPI, UART/USART, EBI/EMI, I2C, AC97, ISI, CAN
Core ProcessorARM926EJ-S
Display & Interface ControllersLCD
Ethernet10 Mbps, 100 Mbps
Graphics AccelerationTrue
Mounting TypeSurface Mount
Number of Cores/Bus Width32 Bit, 1 Core
Operating Temperature [Max]85 °C
Operating Temperature [Min]-40 °C
Package / Case324-TFBGA
RAM ControllersSRAM, SDRAM
Speed200 MHz
Supplier Device Package324-TFBGA (15x15)
USBUSB 2.0 (2)
Voltage - I/O2 V, 3.3 V, 3 V, 2.5 V, 1.8 V, 2.7 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
Microchip DirectT/R 1$ 19.79
25$ 18.00
100$ 16.29
1000$ 14.89
5000$ 14.28

Description

General part information

AT91SAM9263 Series

Recommended substitute device - [SAM9X60](https://www.microchip.com/en-us/product/SAM9X60)

The Microchip's ARM®-based SAM9263 microprocessor runs at 240MHz and features a powerful peripheral set. User interface peripherals include a camera interface, TFT/STN LCD controller, an AC97 and I2S. Networking peripherals include USB host and device interfaces, a 10/100 Ethernet MAC and CAN. There are also four USARTs, two SPIs, CompactFlash, SD/SDIO/MMC interface and a TWI. The multi-layer bus architecture associated with 28 DMA channels, 96KB of SRAM that can be configured as TCM, and the dual bus interface, sustain the high bandwidth required by the processor and its peripherals. The SAM9263 is available in a BGA324 package with 0.8mm ball pitch.