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40-LLP; SQA40A
Integrated Circuits (ICs)

DS10BR254TSQ/NOPB

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Texas Instruments

IC MULTIPLEXER LVDS 1CH 40WQFN

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40-LLP; SQA40A
Integrated Circuits (ICs)

DS10BR254TSQ/NOPB

Active
Texas Instruments

IC MULTIPLEXER LVDS 1CH 40WQFN

Technical Specifications

Parameters and characteristics for this part

SpecificationDS10BR254TSQ/NOPB
ApplicationsLVDS
Current - Supply113 mA
Data Rate (Max)1.5 Gbps
Delay Time440 ps
Mounting TypeSurface Mount
Number of Channels [custom]2
Number of Channels [custom]1
Number of Channels [custom]4
Operating Temperature [Max]85 °C
Operating Temperature [Min]-40 °C
OutputLVDS
Package / Case40-WFQFN Exposed Pad
Supplier Device Package40-WQFN (6x6)
TypeMultiplexer, Buffer
Voltage - Supply [Max]3.6 V
Voltage - Supply [Min]3 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 9.52
10$ 8.60
25$ 8.20
100$ 7.12
Digi-Reel® 1$ 9.52
10$ 8.60
25$ 8.20
100$ 7.12
Tape & Reel (TR) 250$ 6.80
500$ 6.20
1250$ 5.40
Texas InstrumentsSMALL T&R 1$ 7.29
100$ 5.94
250$ 4.67
1000$ 3.96

Description

General part information

DS10BR254 Series

The DS10BR254 is a 1.5 Gbps 1:4 LVDS repeater optimized for high-speed signal routing and distribution over FR-4 printed circuit board backplanes and balanced cables. Fully differential signal paths ensure exceptional signal integrity and noise immunity.

The device has two different LVDS input channels and a select pin determines which input is active. A loss-of-signal (LOS) circuit monitors both input channels and a uniqueLOSpin is asserted when no signal is detected at that input.

Wide input common mode range allows the switch to accept signals with LVDS, CML and LVPECL levels; the output levels are LVDS. A very small package footprint requires a minimal space on the board while the flow-through pinout allows easy board layout. Each differential input and output is internally terminated with a 100Ω resistor to lower device return losses, reduce component count and further minimize board space.

Documents

Technical documentation and resources