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Technical Specifications
Parameters and characteristics for this part
| Specification | OMAP5910JZVL2 |
|---|---|
| Additional Interfaces | I2C, McBSP, IrDA, MCSI, MMC/SD, I2S, SPI, AC97, UART, 1-Wire/HDQ, Microwire |
| Co-Processors/DSP | System Control, CP15, Signal Processing, C55x |
| Core Processor | ARM9TDMI |
| Display & Interface Controllers | Keypad, LCD |
| Graphics Acceleration | False |
| Mounting Type | Surface Mount |
| Number of Cores/Bus Width | 32 Bit, 1 Core |
| Operating Temperature [Max] | 85 °C |
| Operating Temperature [Min] | -40 °C |
| Package / Case | 289-TFBGA |
| Speed | 150 MHz |
| Supplier Device Package | 289-NFBGA (12x12) |
| USB | USB 2.0 (2) |
| Voltage - I/O | 1.8 V, 2.75 V, 3.3 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Tray | 160 | $ 35.73 | |
| Texas Instruments | JEDEC TRAY (5+1) | 1 | $ 37.32 | |
| 100 | $ 33.18 | |||
| 250 | $ 27.27 | |||
| 1000 | $ 24.39 | |||
Description
General part information
OMAP5910 Series
The OMAP5910 is a highly integrated hardware and software platform, designed to meet the application processing needs of next-generation embedded devices.
The OMAP™ platform enables OEMs and ODMs to quickly bring to market devices featuring rich user interfaces, high processing performance, and long battery life through the maximum flexibility of a fully integrated mixed processor solution.
The dual-core architecture provides benefits of both DSP and RISC technologies, incorporating a TMS320C55x DSP core and a high-performance TI925T ARM core.
Documents
Technical documentation and resources
