Soldering, Desoldering, Rework Products

SMD3SWLT.040 50G

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SN42/BI58 2.2% FLUX CORE SOLDER

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Soldering, Desoldering, Rework Products

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SN42/BI58 2.2% FLUX CORE SOLDER

Technical Specifications

Parameters and characteristics for this part

Part	Melting Point	Melting Point	Form	Form	Form	Flux Type	Composition	Process	Type	Diameter [diameter]	Diameter [diameter]	Form	Composition
Chip Quik Inc. SMD3SW.031 1OZ	179 °C	354 °F	1 oz	28.35 g	Spool	No-Clean Water Soluble	Sn62Pb36Ag2 (62/36/2)	Leaded	Wire Solder
Chip Quik Inc. SMD3SWLT.047 8OZ	138 °C	280 °F	227 g	0.5 lb	Spool		Bi58Sn42		Wire Solder	0.047 in	1.19 mm	8 oz	58/42
Chip Quik Inc. SMD3SWLT.040 20G	138 °C	280 °F	20 g		Spool	No-Clean Rosin Activated (RA)	Bi58Sn42		Wire Solder	0.04 in	1.02 mm	0.7 oz	58/42
Chip Quik Inc. SMD3SWLT.040 100G	138 °C	280 °F	100 g		Spool	No-Clean Rosin Activated (RA)	Bi58Sn42		Wire Solder	0.04 in	1.02 mm	3.53 oz	58/42
Chip Quik Inc. SMD3SWLT.047 4OZ	138 °C	280 °F	113.4 g		Spool		Bi58Sn42		Wire Solder	0.047 in	1.19 mm	4 oz	58/42
Chip Quik Inc. SMD3SWLT.047 2OZ	138 °C	280 °F	56.7 g		Spool		Bi58Sn42		Wire Solder	0.047 in	1.19 mm	2 oz	58/42
Chip Quik Inc. SMD3SWLT.047 1OZ	138 °C	280 °F	1 oz	28.35 g	Spool		Bi58Sn42		Wire Solder	0.047 in	1.19 mm		58/42
Chip Quik Inc. SMD3SWLT.040 10G	138 °C	280 °F	10 g		Spool	No-Clean Rosin Activated (RA)	Bi58Sn42		Wire Solder	0.04 in	1.02 mm	0.35 oz	58/42
Chip Quik Inc. SMD3SWLT.040 50G	138 °C	280 °F	50 g		Spool	No-Clean Rosin Activated (RA)	Bi58Sn42		Wire Solder	0.04 in	1.02 mm	1.8 oz	58/42

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

Lead Free No-Clean, Rosin Activated (RA) Wire Solder Bi58Sn42 (58/42) Spool, 1.8 oz (50g)

Technical documentation and resources