SMD3S Series
Manufacturer: Chip Quik Inc.
Beta
⌘K
SOLDER WIRE 62/36/2 TIN/LEAD/SIL
| Part | Melting Point | Melting Point | Form | Form | Form | Flux Type | Composition | Process | Type | Diameter [diameter] | Diameter [diameter] | Form | Composition |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Chip Quik Inc. | 179 °C | 354 °F | 1 oz | 28.35 g | Spool | No-Clean Water Soluble | Sn62Pb36Ag2 (62/36/2) | Leaded | Wire Solder | ||||
 Chip Quik Inc. | 138 °C | 280 °F | 227 g | 0.5 lb | Spool | Bi58Sn42 | Wire Solder | 0.047 in | 1.19 mm | 8 oz | 58/42 | ||
 Chip Quik Inc. | 138 °C | 280 °F | 20 g | Spool | No-Clean Rosin Activated (RA) | Bi58Sn42 | Wire Solder | 0.04 in | 1.02 mm | 0.7 oz | 58/42 | ||
 Chip Quik Inc. | 138 °C | 280 °F | 100 g | Spool | No-Clean Rosin Activated (RA) | Bi58Sn42 | Wire Solder | 0.04 in | 1.02 mm | 3.53 oz | 58/42 | ||
 Chip Quik Inc. | 138 °C | 280 °F | 113.4 g | Spool | Bi58Sn42 | Wire Solder | 0.047 in | 1.19 mm | 4 oz | 58/42 | |||
 Chip Quik Inc. | 138 °C | 280 °F | 56.7 g | Spool | Bi58Sn42 | Wire Solder | 0.047 in | 1.19 mm | 2 oz | 58/42 | |||
 Chip Quik Inc. | 138 °C | 280 °F | 1 oz | 28.35 g | Spool | Bi58Sn42 | Wire Solder | 0.047 in | 1.19 mm | 58/42 | |||
 Chip Quik Inc. | 138 °C | 280 °F | 10 g | Spool | No-Clean Rosin Activated (RA) | Bi58Sn42 | Wire Solder | 0.04 in | 1.02 mm | 0.35 oz | 58/42 | ||
 Chip Quik Inc. | 138 °C | 280 °F | 50 g | Spool | No-Clean Rosin Activated (RA) | Bi58Sn42 | Wire Solder | 0.04 in | 1.02 mm | 1.8 oz | 58/42 |