Specification	BUK6D230-80EX

Current - Continuous Drain (Id) @ 25°C	5.1 A, 1.9 A
Drain to Source Voltage (Vdss)	80 V
Drive Voltage (Max Rds On, Min Rds On)	10 V, 4.5 V
FET Type	N-Channel
Gate Charge (Qg) (Max) @ Vgs [Max]	7.2 nC
Grade	Automotive
Input Capacitance (Ciss) (Max) @ Vds	215 pF
Mounting Type	Surface Mount
Operating Temperature [Max]	175 ░C
Operating Temperature [Min]	-55 °C
Package / Case	6-UDFN Exposed Pad
Power Dissipation (Max)	15 W, 2 W
Qualification	AEC-Q101
Rds On (Max) @ Id, Vgs	230 mOhm
Supplier Device Package	DFN2020MD-6
Technology	MOSFET (Metal Oxide)
Vgs (Max)	20 V
Vgs(th) (Max) @ Id	2.7 V

BUK6D230-80E Series

80 V, N-channel Trench MOSFET

Part	Technology	Vgs (Max)	Drain to Source Voltage (Vdss)	Input Capacitance (Ciss) (Max) @ Vds	Operating Temperature [Min]	Operating Temperature [Max]	Gate Charge (Qg) (Max) @ Vgs [Max]	Drive Voltage (Max Rds On, Min Rds On)	FET Type	Package / Case	Vgs(th) (Max) @ Id	Power Dissipation (Max)	Mounting Type	Grade	Current - Continuous Drain (Id) @ 25°C	Supplier Device Package	Qualification	Rds On (Max) @ Id, Vgs
Freescale Semiconductor - NXP BUK6D230-80EX	MOSFET (Metal Oxide)	20 V	80 V	215 pF	-55 °C	175 ░C	7.2 nC	4.5 V 10 V	N-Channel	6-UDFN Exposed Pad	2.7 V	2 W 15 W	Surface Mount	Automotive	1.9 A 5.1 A	DFN2020MD-6	AEC-Q101	230 mOhm

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Cut Tape (CT)	1	$ 0.55
		10	$ 0.34
		100	$ 0.22
		500	$ 0.16
		1000	$ 0.15
	Digi-Reel®	1	$ 0.55
		10	$ 0.34
		100	$ 0.22
		500	$ 0.16
		1000	$ 0.15
	Tape & Reel (TR)	3000	$ 0.12
		6000	$ 0.11
		9000	$ 0.11
		15000	$ 0.10
		21000	$ 0.10
		30000	$ 0.09
		75000	$ 0.09

Description

General part information

BUK6D230-80E Series

N-channel enhancement mode Field-Effect Transistor (FET) in a medium power DFN2020MD-6 (SOT1220) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology.

Documents

Technical documentation and resources

Datasheet

plastic, leadless thermal enhanced ultra thin small outline package with side-wettable flanks (SWF); 6 terminals; 0.65 mm pitch; 2 mm x 2 mm x 0.65 mm body

Package information

plastic, thermal enhanced ultra thin small outline package; no leads; 6 terminals; 0.65 mm pitch; 2 mm x 2 mm x 0.65 mm body

Marcom graphics

Small & light automotive diodes and transistors

Leaflet

Questions about package outline drawings

Application note

BUK6D230-80EX

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BUK6D230-80EX

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Technical Specifications

BUK6D230-80E Series

Pricing

Description

BUK6D230-80E Series

Documents

Datasheet

Automatic Optical Inspection of DFN Components

Nexperia package poster

小巧轻便的汽车 二极管和晶体管

plastic, leadless thermal enhanced ultra thin small outline package with side-wettable flanks (SWF); 6 terminals; 0.65 mm pitch; 2 mm x 2 mm x 0.65 mm body

plastic, thermal enhanced ultra thin small outline package; no leads; 6 terminals; 0.65 mm pitch; 2 mm x 2 mm x 0.65 mm body

Small & light automotive diodes and transistors

Questions about package outline drawings

BUK6D230-80E Series

小巧轻便的汽车二极管和晶体管