Zenode.ai Logo
Beta
Samtec-TLW-110-05-G-S-02 Connector Headers and PCB Receptacles Conn Unshrouded Header HDR 10 POS 2.54mm Solder ST Top Entry Thru-Hole Bulk
Connectors, Interconnects

TLW-110-05-G-S-02

Active
Samtec Inc.

CONN UNSHROUDED HEADER HDR 10 POS 2.54MM SOLDER ST TOP ENTRY THRU-HOLE BULK

Deep-Dive with AI

Search across all available documentation for this part.

Samtec-TLW-110-05-G-S-02 Connector Headers and PCB Receptacles Conn Unshrouded Header HDR 10 POS 2.54mm Solder ST Top Entry Thru-Hole Bulk
Connectors, Interconnects

TLW-110-05-G-S-02

Active
Samtec Inc.

CONN UNSHROUDED HEADER HDR 10 POS 2.54MM SOLDER ST TOP ENTRY THRU-HOLE BULK

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationTLW-110-05-G-S-02
Connector TypeHeader
Contact Finish - MatingGold
Contact Finish - PostGold
Contact Finish Thickness - Mating10 çin
Contact Finish Thickness - Mating0.25 çm
Contact Finish Thickness - PostFlash
Contact Length - Post4.32 mm
Contact Length - Post0.17 in
Contact MaterialPhosphor Bronze
Contact ShapeSquare
Contact TypeMale Pin
Current Rating (Amps)5.2 A
Fastening TypePush-Pull
Insulation ColorBlack
Insulation Height [z]0.06 in
Insulation Height [z]1.52 mm
Insulation MaterialLiquid Crystal Polymer (LCP)
Mounting TypeThrough Hole
Number of Positions10
Number of Positions Loaded9
Number of Rows1
Operating Temperature [Max]125 °C
Operating Temperature [Min]-55 °C
Overall Contact Length8.51 mm
Overall Contact Length0.335 in
Pitch - Mating0.1 in
Pitch - Mating2.54 mm
ShroudingUnshrouded
StyleBoard to Board, Cable
TerminationSolder
PartFastening TypeTerminationInsulation ColorMounting TypeOperating Temperature [Min]Operating Temperature [Max]Contact Length - PostContact Length - PostContact Finish - PostOverall Contact LengthOverall Contact LengthContact Finish - MatingContact Finish Thickness - PostShroudingContact Finish Thickness - MatingContact Finish Thickness - MatingInsulation MaterialConnector TypeNumber of RowsPitch - MatingPitch - MatingContact ShapeNumber of PositionsContact MaterialInsulation Height [z]Insulation Height [z]Number of Positions LoadedStyleCurrent Rating (Amps)Contact TypeContact Length - Post [x]Contact Length - Post [x]Number of Positions LoadedContact Length - Mating [x]Contact Length - MatingRow Spacing - Mating [x]Row Spacing - Mating [x]Insulation HeightInsulation Height
Push-Pull
Solder
Black
Through Hole
-55 °C
125 °C
4.32 mm
0.17 in
Gold
8.51 mm
0.335 in
Gold
Flash
Unshrouded
10 çin
0.25 çm
Liquid Crystal Polymer (LCP)
Header
1
0.1 in
2.54 mm
Square
10
Phosphor Bronze
0.06 in
1.52 mm
9
Board to Board
Cable
5.2 A
Male Pin
Samtec Inc.
Flex Stack TLW
Samtec Inc.
Push-Pull
Solder
Black
Through Hole
-55 °C
105 ░C
Tin
7.62 mm
0.3 in
Unshrouded
Liquid Crystal Polymer (LCP)
Header
1
0.1 in
2.54 mm
Square
10
Phosphor Bronze
0.06 in
1.52 mm
Board to Board
Cable
5.2 A
Male Pin
0.135 in
3.43 mm
All
Push-Pull
Solder
Black
Through Hole
Right Angle
-55 °C
105 ░C
Tin
Unshrouded
Liquid Crystal Polymer (LCP)
Header
1
0.1 in
2.54 mm
Square
10
Phosphor Bronze
0.098 in
2.5 mm
Board to Board
Cable
5.2 A
Male Pin
0.12 in
3.05 mm
All
0.23 in
5.84 mm
Flex Stack TLW
Samtec Inc.
Push-Pull
Solder
Black
Through Hole
-55 °C
125 °C
Gold
7.62 mm
0.3 in
Gold
Flash
Unshrouded
10 çin
0.25 çm
Liquid Crystal Polymer (LCP)
Header
2
0.1 in
2.54 mm
Square
20
Phosphor Bronze
0.06 in
1.52 mm
Board to Board
Cable
5.2 A
Male Pin
0.135 in
3.43 mm
All
2.54 mm
0.1 in
Push-Pull
Solder
Black
Through Hole
Right Angle
-55 °C
125 °C
Gold
Gold
Flash
Unshrouded
10 çin
0.25 çm
Liquid Crystal Polymer (LCP)
Header
2
0.1 in
2.54 mm
Square
20
Phosphor Bronze
Board to Board
Cable
5.2 A
Male Pin
0.12 in
3.05 mm
All
0.23 in
5.84 mm
2.54 mm
0.1 in
0.197 in
5 mm
Samtec Inc.
Push-Pull
Solder
Black
Through Hole
-55 °C
125 °C
7.62 mm
0.3 in
Gold
Unshrouded
Liquid Crystal Polymer (LCP)
Header
1
0.1 in
2.54 mm
Square
10
Phosphor Bronze
0.06 in
1.52 mm
Board to Board
Cable
5.2 A
Male Pin
0.135 in
3.43 mm
All
Flex Stack TLW
Samtec Inc.
Push-Pull
Solder
Black
Through Hole
-55 °C
105 ░C
4.32 mm
0.17 in
Tin
8.51 mm
0.335 in
Unshrouded
Liquid Crystal Polymer (LCP)
Header
2
0.1 in
2.54 mm
Square
20
Phosphor Bronze
0.06 in
1.52 mm
Board to Board
Cable
5.2 A
Male Pin
All
2.54 mm
0.1 in
Push-Pull
Solder
Black
Through Hole
-55 °C
125 °C
4.32 mm
0.17 in
Gold
8.51 mm
0.335 in
Gold
Flash
Unshrouded
10 çin
0.25 çm
Liquid Crystal Polymer (LCP)
Header
2
0.1 in
2.54 mm
Square
20
Phosphor Bronze
0.06 in
1.52 mm
19
Board to Board
Cable
5.2 A
Male Pin
2.54 mm
0.1 in
Push-Pull
Solder
Black
Through Hole
-55 °C
125 °C
Gold
7.62 mm
0.3 in
Gold
Flash
Unshrouded
10 çin
0.25 çm
Liquid Crystal Polymer (LCP)
Header
2
0.1 in
2.54 mm
Square
20
Phosphor Bronze
0.06 in
1.52 mm
19
Board to Board
Cable
5.2 A
Male Pin
0.135 in
3.43 mm
2.54 mm
0.1 in

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
ArrowN/A 1$ 3.03
50$ 2.47
100$ 2.10
500$ 1.86
DigikeyBulk 1$ 3.03

Description

General part information

TLW-110 Series

Connector Header Through Hole 10 position 0.100" (2.54mm)

Documents

Technical documentation and resources

No documents available