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Connectors, Interconnects

TLW-110-06-TM-S

Active
Samtec Inc.

LOW PROFILE .025 SQ STRIPS

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DocumentsDatasheet
Connectors, Interconnects

TLW-110-06-TM-S

Active
Samtec Inc.

LOW PROFILE .025 SQ STRIPS

Deep-Dive with AI

DocumentsDatasheet

Technical Specifications

Parameters and characteristics for this part

SpecificationTLW-110-06-TM-S
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PartFastening TypeTerminationInsulation ColorMounting TypeOperating Temperature [Min]Operating Temperature [Max]Contact Length - PostContact Length - PostContact Finish - PostOverall Contact LengthOverall Contact LengthContact Finish - MatingContact Finish Thickness - PostShroudingContact Finish Thickness - MatingContact Finish Thickness - MatingInsulation MaterialConnector TypeNumber of RowsPitch - MatingPitch - MatingContact ShapeNumber of PositionsContact MaterialInsulation Height [z]Insulation Height [z]Number of Positions LoadedStyleCurrent Rating (Amps)Contact TypeContact Length - Post [x]Contact Length - Post [x]Number of Positions LoadedContact Length - Mating [x]Contact Length - MatingRow Spacing - Mating [x]Row Spacing - Mating [x]Insulation HeightInsulation Height
Push-Pull
Solder
Black
Through Hole
-55 °C
125 °C
4.32 mm
0.17 in
Gold
8.51 mm
0.335 in
Gold
Flash
Unshrouded
10 çin
0.25 çm
Liquid Crystal Polymer (LCP)
Header
1
0.1 in
2.54 mm
Square
10
Phosphor Bronze
0.06 in
1.52 mm
9
Board to Board
Cable
5.2 A
Male Pin
Samtec Inc.
Flex Stack TLW
Samtec Inc.
Push-Pull
Solder
Black
Through Hole
-55 °C
105 ░C
Tin
7.62 mm
0.3 in
Unshrouded
Liquid Crystal Polymer (LCP)
Header
1
0.1 in
2.54 mm
Square
10
Phosphor Bronze
0.06 in
1.52 mm
Board to Board
Cable
5.2 A
Male Pin
0.135 in
3.43 mm
All
Push-Pull
Solder
Black
Through Hole
Right Angle
-55 °C
105 ░C
Tin
Unshrouded
Liquid Crystal Polymer (LCP)
Header
1
0.1 in
2.54 mm
Square
10
Phosphor Bronze
0.098 in
2.5 mm
Board to Board
Cable
5.2 A
Male Pin
0.12 in
3.05 mm
All
0.23 in
5.84 mm
Flex Stack TLW
Samtec Inc.
Push-Pull
Solder
Black
Through Hole
-55 °C
125 °C
Gold
7.62 mm
0.3 in
Gold
Flash
Unshrouded
10 çin
0.25 çm
Liquid Crystal Polymer (LCP)
Header
2
0.1 in
2.54 mm
Square
20
Phosphor Bronze
0.06 in
1.52 mm
Board to Board
Cable
5.2 A
Male Pin
0.135 in
3.43 mm
All
2.54 mm
0.1 in
Push-Pull
Solder
Black
Through Hole
Right Angle
-55 °C
125 °C
Gold
Gold
Flash
Unshrouded
10 çin
0.25 çm
Liquid Crystal Polymer (LCP)
Header
2
0.1 in
2.54 mm
Square
20
Phosphor Bronze
Board to Board
Cable
5.2 A
Male Pin
0.12 in
3.05 mm
All
0.23 in
5.84 mm
2.54 mm
0.1 in
0.197 in
5 mm
Samtec Inc.
Push-Pull
Solder
Black
Through Hole
-55 °C
125 °C
7.62 mm
0.3 in
Gold
Unshrouded
Liquid Crystal Polymer (LCP)
Header
1
0.1 in
2.54 mm
Square
10
Phosphor Bronze
0.06 in
1.52 mm
Board to Board
Cable
5.2 A
Male Pin
0.135 in
3.43 mm
All
Flex Stack TLW
Samtec Inc.
Push-Pull
Solder
Black
Through Hole
-55 °C
105 ░C
4.32 mm
0.17 in
Tin
8.51 mm
0.335 in
Unshrouded
Liquid Crystal Polymer (LCP)
Header
2
0.1 in
2.54 mm
Square
20
Phosphor Bronze
0.06 in
1.52 mm
Board to Board
Cable
5.2 A
Male Pin
All
2.54 mm
0.1 in
Push-Pull
Solder
Black
Through Hole
-55 °C
125 °C
4.32 mm
0.17 in
Gold
8.51 mm
0.335 in
Gold
Flash
Unshrouded
10 çin
0.25 çm
Liquid Crystal Polymer (LCP)
Header
2
0.1 in
2.54 mm
Square
20
Phosphor Bronze
0.06 in
1.52 mm
19
Board to Board
Cable
5.2 A
Male Pin
2.54 mm
0.1 in
Push-Pull
Solder
Black
Through Hole
-55 °C
125 °C
Gold
7.62 mm
0.3 in
Gold
Flash
Unshrouded
10 çin
0.25 çm
Liquid Crystal Polymer (LCP)
Header
2
0.1 in
2.54 mm
Square
20
Phosphor Bronze
0.06 in
1.52 mm
19
Board to Board
Cable
5.2 A
Male Pin
0.135 in
3.43 mm
2.54 mm
0.1 in

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 1$ 1.71

Description

General part information

TLW-110 Series

Connector Header position

Documents

Technical documentation and resources