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Technical Specifications
Parameters and characteristics for this part
| Specification | HMC-ALH382-SX |
|---|---|
| Current - Supply | 64 mA |
| Frequency [Max] | 65 GHz |
| Frequency [Min] | 57 GHz |
| Gain | 21 dB |
| Mounting Type | Surface Mount |
| Noise Figure | 4 dB |
| P1dB | 12 dBm |
| Package / Case | Die |
| RF Type | WLAN, 802.11/WiFi |
| Supplier Device Package | Die |
| Test Frequency [Max] | 65 GHz |
| Test Frequency [Min] | 57 GHz |
| Voltage - Supply | 2.5 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Tray | 2 | $ 168.88 | |
| 4 | $ 159.06 | |||
| 6 | $ 153.90 | |||
| 10 | $ 147.96 | |||
| 14 | $ 144.37 | |||
| 20 | $ 140.82 | |||
| 50 | $ 132.80 | |||
Description
General part information
HMC-ALH382-DIE Series
The HMC-ALH382 is a high dynamic range, four stage GaAs HEMT MMIC Low Noise Amplifier (LNA) which operates between 57 and 65 GHz. The HMC-ALH382 features 21 dB of small signal gain, 4 dB of noise figure and an output power of +12 dBm at 1dB compression from a +2.5V supply voltage. All bond pads and the die backside are Ti/Au metallized and the amplifier device is fully passivated for reliable operation.This versatile LNA is compatible with conventional die attach methods, as well as thermocompression thermosonic wirebonding, making it ideal for MCM and hybrid microcircuit applications. All data shown herein is measured with the chip in a 50 Ohm environment and contacted with RF probes.ApplicationsShort Haul / High Capacity LinksWireless LANsMilitary & Space
Documents
Technical documentation and resources