Integrated Circuits (ICs)

MCP2025T-330E/SN

LTB

DATACOM, ETHERNET TRANSCEIVER

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Integrated Circuits (ICs)

LTB

DATACOM, ETHERNET TRANSCEIVER

Technical Specifications

Parameters and characteristics for this part

Part	Supplier Device Package	Operating Temperature [Max]	Operating Temperature [Min]	Type	Protocol	Package / Case	Voltage - Supply [Max]	Voltage - Supply [Min]	Receiver Hysteresis	Mounting Type	Duplex	Package / Case	Package / Case	Package / Case [y]	Package / Case [x]
Microchip Technology MCP2025T-330E/MD	8-DFN (4x4)	125 °C	-40 °C	Transceiver	LINbus	8-VDFN Exposed Pad	18 V	6 V	175 mV	Surface Mount	Half
Microchip Technology MCP2025-500E/P	8-PDIP	125 °C	-40 °C	Transceiver	LINbus	8-DIP	18 V	6 V	175 mV	Through Hole	Half	0.3 in	7.62 mm
Microchip Technology MCP2025-500E/SN	8-SOIC	125 °C	-40 °C	Transceiver	LINbus	8-SOIC	18 V	6 V	175 mV	Surface Mount	Half			3.9 mm	0.154 in
Microchip Technology MCP2025T-500E/SN	8-SOIC	125 °C	-40 °C	Transceiver	LINbus	8-SOIC	18 V	6 V	175 mV	Surface Mount	Half			3.9 mm	0.154 in
Microchip Technology MCP2025-500E/MD	8-DFN (4x4)	125 °C	-40 °C	Transceiver	LINbus	8-VDFN Exposed Pad	18 V	6 V	175 mV	Surface Mount	Half
Microchip Technology MCP2025T-330E/SN	8-SOIC	125 °C	-40 °C	Transceiver	LINbus	8-SOIC	18 V	6 V	175 mV	Surface Mount	Half			3.9 mm	0.154 in
Microchip Technology MCP2025-330E/SN	8-SOIC	125 °C	-40 °C	Transceiver	LINbus	8-SOIC	18 V	6 V	175 mV	Surface Mount	Half			3.9 mm	0.154 in
Microchip Technology MCP2025-330E/P	8-PDIP	125 °C	-40 °C	Transceiver	LINbus	8-DIP	18 V	6 V	175 mV	Through Hole	Half	0.3 in	7.62 mm
Microchip Technology MCP2025T-500E/MD	8-DFN (4x4)	125 °C	-40 °C	Transceiver	LINbus	8-VDFN Exposed Pad	18 V	6 V	175 mV	Surface Mount	Half

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tape & Reel (TR)	3300	$ 1.32

General part information

1/1 Transceiver Half LINbus 8-SOIC

Technical documentation and resources