Connectors, Interconnects

A60-113-235N414

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EDAC Inc.

MODULAR CONNECTOR, RJ45 JACK, 1 X 1 (PORT), 8P8C, THROUGH HOLE MOUNT

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DocumentsDatasheet Enhanced Product Overview EN +1

Connectors, Interconnects

A60-113-235N414

Active

EDAC Inc.

MODULAR CONNECTOR, RJ45 JACK, 1 X 1 (PORT), 8P8C, THROUGH HOLE MOUNT

Deep-Dive with AI

DocumentsDatasheet Enhanced Product Overview EN +1

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Technical Specifications

Parameters and characteristics for this part

Specification	A60-113-235N414

Applications	10/100/1000 Base-T, AutoMDIX
Connector Type	RJ45
Contact Finish	Gold
Contact Finish Thickness	0.38 µm
Contact Finish Thickness	15 µin
Contact Material	Phosphor Bronze
Features	Board Lock
Height Above Board [z]	0.532 in
Height Above Board [z]	13.51 mm
Housing Material	Polyester, Glass Filled, Polyamide (PA), Nylon
LED Color	Yellow, Green
Mounting Type	Through Hole
Number of Cores per Jack	8
Number of Ports	1
Number of Rows	1
Operating Temperature [Max]	70 °C
Operating Temperature [Min]	0 °C
Orientation	90 °
Shield Material	Copper Alloy
Shielding	EMI Finger, Shielded
Tab Direction	Up
Termination	Solder

A60-113 Series

Part	Housing Material	Contact Finish Thickness	Contact Finish Thickness	Shield Material	Features	Contact Material	Shielding	Mounting Type	Connector Type	Applications	LED Color	Contact Finish	Number of Cores per Jack	Termination	Height Above Board [z]	Height Above Board [z]	Operating Temperature [Max]	Orientation	Number of Ports	Number of Rows	Tab Direction
EDAC Inc. A60-113-231N432	Nylon Polyamide (PA) Polyester Glass Filled	0.38 µm	15 µin	Copper Alloy	Board Lock	Phosphor Bronze	EMI Finger Shielded	Through Hole	RJ45	10/100/1000 Base-T AutoMDIX	Green - Yellow	Gold	8	Solder	0.532 in	13.51 mm	70 °C	90 °	1	1	Up
EDAC Inc. A60-113-331P432	Polybutylene Terephthalate (PBT) Glass Filled	0.38 µm	15 µin	Copper Alloy	Board Lock	Phosphor Bronze	EMI Finger Shielded	Through Hole	RJ45	10/100/1000 Base-T AutoMDIX	Green - Yellow	Gold	8	Solder	0.535 in	13.59 mm	70 °C	90 °	1	1	Down
EDAC Inc. A60-113-271N414	Nylon Polyamide (PA) Polyester	0.38 µm	15 µin	Copper Alloy	Board Lock	Phosphor Bronze	EMI Finger Shielded	Through Hole	RJ45	10/100/1000 Base-T AutoMDIX	Green Orange Yellow	Gold	8	Solder	0.53 in	13.45 mm	70 °C	90 °	1	1	Up
EDAC Inc. A60-113-300P432	Polybutylene Terephthalate (PBT) Glass Filled	0.38 µm	15 µin	Copper Alloy	Board Lock	Phosphor Bronze	EMI Finger Shielded	Through Hole	RJ45	10/100/1000 Base-T AutoMDIX	Does Not Contain LED	Gold	8	Solder	0.535 in	13.59 mm	70 °C	90 °	1	1	Down
EDAC Inc. A60-113-331P411	Polybutylene Terephthalate (PBT) Glass Filled	0.38 µm	15 µin	Copper Alloy	Board Lock	Phosphor Bronze	EMI Finger Shielded	Through Hole	RJ45	10/100/1000 Base-T AutoMDIX	Green - Yellow	Gold	8	Solder	0.535 in	13.59 mm	70 °C	90 °	1	1	Down
EDAC Inc. A60-113-235N414	Nylon Polyamide (PA) Polyester Glass Filled	0.38 µm	15 µin	Copper Alloy	Board Lock	Phosphor Bronze	EMI Finger Shielded	Through Hole	RJ45	10/100/1000 Base-T AutoMDIX	Green Yellow	Gold	8	Solder	0.532 in	13.51 mm	70 °C	90 °	1	1	Up