A60-113 Series
Manufacturer: EDAC Inc.
MODULAR CONNECTOR, RJ45 JACK, 1 X 1 (PORT), 8P8C, THROUGH HOLE MOUNT
| Part | Housing Material | Contact Finish Thickness | Contact Finish Thickness | Shield Material | Features | Contact Material | Shielding | Mounting Type | Connector Type | Applications | LED Color | Contact Finish | Number of Cores per Jack | Termination | Height Above Board [z] | Height Above Board [z] | Operating Temperature [Max] | Operating Temperature [Min] | Orientation | Number of Ports | Number of Rows | Tab Direction |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
EDAC Inc. | Nylon Polyamide (PA) Polyester Glass Filled | 0.38 µm | 15 µin | Copper Alloy | Board Lock | Phosphor Bronze | EMI Finger Shielded | Through Hole | RJ45 | 10/100/1000 Base-T AutoMDIX | Green - Yellow | Gold | 8 | Solder | 0.532 in | 13.51 mm | 70 °C | 0 °C | 90 ° | 1 | 1 | Up |
EDAC Inc. | Polybutylene Terephthalate (PBT) Glass Filled | 0.38 µm | 15 µin | Copper Alloy | Board Lock | Phosphor Bronze | EMI Finger Shielded | Through Hole | RJ45 | 10/100/1000 Base-T AutoMDIX | Green - Yellow | Gold | 8 | Solder | 0.535 in | 13.59 mm | 70 °C | 0 °C | 90 ° | 1 | 1 | Down |
EDAC Inc. | Nylon Polyamide (PA) Polyester | 0.38 µm | 15 µin | Copper Alloy | Board Lock | Phosphor Bronze | EMI Finger Shielded | Through Hole | RJ45 | 10/100/1000 Base-T AutoMDIX | Green Orange Yellow | Gold | 8 | Solder | 0.53 in | 13.45 mm | 70 °C | 0 °C | 90 ° | 1 | 1 | Up |
EDAC Inc. | Polybutylene Terephthalate (PBT) Glass Filled | 0.38 µm | 15 µin | Copper Alloy | Board Lock | Phosphor Bronze | EMI Finger Shielded | Through Hole | RJ45 | 10/100/1000 Base-T AutoMDIX | Does Not Contain LED | Gold | 8 | Solder | 0.535 in | 13.59 mm | 70 °C | 0 °C | 90 ° | 1 | 1 | Down |
EDAC Inc. | Polybutylene Terephthalate (PBT) Glass Filled | 0.38 µm | 15 µin | Copper Alloy | Board Lock | Phosphor Bronze | EMI Finger Shielded | Through Hole | RJ45 | 10/100/1000 Base-T AutoMDIX | Green - Yellow | Gold | 8 | Solder | 0.535 in | 13.59 mm | 70 °C | 0 °C | 90 ° | 1 | 1 | Down |
EDAC Inc. | Nylon Polyamide (PA) Polyester Glass Filled | 0.38 µm | 15 µin | Copper Alloy | Board Lock | Phosphor Bronze | EMI Finger Shielded | Through Hole | RJ45 | 10/100/1000 Base-T AutoMDIX | Green Yellow | Gold | 8 | Solder | 0.532 in | 13.51 mm | 70 °C | 0 °C | 90 ° | 1 | 1 | Up |