The device is a low power, high-performance audio codec that provides three analog input channels, ten DMIC input channels, two PDM output channels, and one high-efficiency Class-D amplifier output channel.The device features a low power HiFi 3z audio DSP core and a low-latency FastDSP core. The audio DSP cores paired with high-fidelity audio data converters are ideal for applications like noise cancellation, transparency, personal sound amplification, and voice processing.When operating in low-power mode, the DSP cores are optimized for small form factor applications such as true wireless stereo (TWS) headphones. In this mode, the device delivers the right level of processing power while still minimizing power consumption to extend play time.The device has the flexibility to also support applications requiring additional processing capability such as over-ear headphones, VR and AR headsets, wearables, hearing assist, and PSAP devices. In high-performance mode, the HiFi 3z core is boosted from 50Mhz to 200MHz, and the FastDSP supports double the number of instructions (up from 64 to 128). This increased processing capability can either be used to offload cycles from the host processor or enable a lower-cost host processor without requiring an additional external audio DSP or MCU.The device supports a -40°C to +85°C temperature range and is available in a space-saving 77-ball WLCSP package (0.4mm pitch, 3.24mm × 4.83mm).APPLICATIONSTrue wireless stereo (TWS) ANC headphonesOver-ear stereo ANC headphonesVR and AR headsets and wearable devicesHearing assist and PSAP devicesSoundbar and smart speaker systemsGaming devices and tablets