PIC16F15245T-I/REB
Active14KB FLASH, 1KB RAM, 10B ADC, 2X PWM, 2X CCP, HLT, WDT, PPS, EUSART, SPI/I2C, XLP SLEEP MODE 20 VQFN 3X3X0.9MM T/R ROHS COMPLIAN
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PIC16F15245T-I/REB
Active14KB FLASH, 1KB RAM, 10B ADC, 2X PWM, 2X CCP, HLT, WDT, PPS, EUSART, SPI/I2C, XLP SLEEP MODE 20 VQFN 3X3X0.9MM T/R ROHS COMPLIAN
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Technical Specifications
Parameters and characteristics for this part
| Specification | PIC16F15245T-I/REB |
|---|---|
| Connectivity | I2C, LINbus, UART/USART, SPI |
| Core Processor | PIC |
| Core Size | 8-Bit |
| Data Converters | 2x10b |
| Data Converters | 12 |
| Mounting Type | Surface Mount |
| Number of I/O | 17 |
| Operating Temperature [Max] | 85 °C |
| Operating Temperature [Min] | -40 °C |
| Oscillator Type | Internal |
| Package / Case | 20-VFQFN Exposed Pad |
| Program Memory Size | 14 KB |
| Program Memory Type | FLASH |
| RAM Size | 1 K |
| Speed | 32 MHz |
| Supplier Device Package | 20-VQFN (3x3) |
| Voltage - Supply (Vcc/Vdd) [Max] | 5.5 V |
| Voltage - Supply (Vcc/Vdd) [Min] | 1.8 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Cut Tape (CT) | 1 | $ 0.79 | |
| 25 | $ 0.72 | |||
| 100 | $ 0.65 | |||
| Digi-Reel® | 1 | $ 0.79 | ||
| 25 | $ 0.72 | |||
| 100 | $ 0.65 | |||
| Tape & Reel (TR) | 3300 | $ 0.65 | ||
| Microchip Direct | T/R | 1 | $ 0.67 | |
| 25 | $ 0.62 | |||
| 100 | $ 0.56 | |||
| 1000 | $ 0.51 | |||
| 5000 | $ 0.49 | |||
| Newark | Each (Supplied on Full Reel) | 100 | $ 0.50 | |
Description
General part information
PIC16F15245 Series
[***Code Examples on GitHub***](https://github.com/orgs/microchip-pic-avr-examples/repositories?q=PIC16F152&type=all&language=&sort=)
The PIC16F152xx 8-bit product family features an essential peripheral set including key Core Independent Peripherals (CIPs), Intelligent Analog, and standard communication modules. Paired with it's ability for eXtreme Low-Power, this family is particularly well-suited for a wide range of low-power applications. Included in the feature set are multiple PWMs, various communication peripherals, an internal temperature sensor, and memory features like a Memory Access Partition (MAP) and Device Information Area (DIA). These product will be offered in a broad selection of packages and pin counts from 8 to 44(40)-pins, to support customers in a variety of applications.
Documents
Technical documentation and resources
