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CP3SP33SMS/NOPB
Integrated Circuits (ICs)

CP3SP33SMSX/NOPB

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Texas Instruments

PROCESSOR WITH CACHE, DSP,BLUETOOTH, USB, DUAL CAN INTERFACE

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CP3SP33SMS/NOPB
Integrated Circuits (ICs)

CP3SP33SMSX/NOPB

Active
Texas Instruments

PROCESSOR WITH CACHE, DSP,BLUETOOTH, USB, DUAL CAN INTERFACE

Technical Specifications

Parameters and characteristics for this part

SpecificationCP3SP33SMSX/NOPB
ApplicationsConnectivity Processor
Controller SeriesCP3000
Core ProcessorCR16C
InterfaceCAN, I2S, EBI/EMI, Microwire/SPI, USB OTG, UART/USART, Audio, Bluetooth, ACCESS.bus
Mounting TypeSurface Mount
Number of I/O64
Operating Temperature [Max]85 °C
Operating Temperature [Min]-40 °C
Package / Case224-LFBGA
Program Memory TypeExternal Program Memory
RAM Size44 K
Supplier Device Package224-NFBGA (13x13)
Voltage - Supply [Max]3.3 V
Voltage - Supply [Min]3 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 16$ 18.87
Tape & Reel (TR) 1000$ 17.15
Texas InstrumentsLARGE T&R 1$ 23.85
100$ 20.83
250$ 16.06
1000$ 14.37

Description

General part information

CP3SP33 Series

The CP3SP33 connectivity processor combines high performance with the massive integration needed for embedded Bluetooth applications. A powerful RISC core with 4Kbyte instruction cache and a Teak® DSP coprocessor provides high computing bandwidth, DMA-driven hardware communications peripherals provide high I/O bandwidth, and an external bus provides system expandability.

On-chip communications peripherals include: Bluetooth Lower Link Controller, Universal Serial Bus (2.0) OTG node and host controller, dual CAN, dual Microwire/Plus/SPI, dual ACCESS.bus, quad UART, 10-bit A/D converter, and telematics/audio codec. Additional on-chip peripherals include DMA controller, dual CVSD/PCM conversion module, I2S and AAI digital audio bus interfaces, Timing and Watchdog Unit, dual Versatile Timer Unit, dual Multi-Function Timer, and Multi-Input Wake-Up (MIWU) unit.

In addition to providing the features needed for the next generation of embedded Bluetooth products, the CP3SP33 is backed up by the software resources that designers need for rapid time-to-market, including an operating system, Bluetooth protocol stack implementation, peripheral drivers, reference designs, and an integrated development environment. Combined with an external program memory and a Bluetooth radio transceiver such as National’s LMX5252, the CP3SP33 provides a complete Bluetooth system solution.