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Technical Specifications
Parameters and characteristics for this part
| Specification | CP3SP33SMR/NOPB |
|---|---|
| Applications | Connectivity Processor |
| Controller Series | CP3000 |
| Core Processor | CR16C |
| Interface | CAN, I2S, EBI/EMI, Microwire/SPI, USB OTG, UART/USART, Audio, Bluetooth, ACCESS.bus |
| Mounting Type | Surface Mount |
| Number of I/O | 36 |
| Operating Temperature [Max] | 85 °C |
| Operating Temperature [Min] | -40 °C |
| Package / Case | 144-LFBGA |
| Program Memory Type | External Program Memory |
| RAM Size | 44 K |
| Supplier Device Package | 144-FBGA (10x10) |
| Voltage - Supply [Max] | 3.3 V |
| Voltage - Supply [Min] | 3 V |
CP3SP33 Series
Processor with Cache, DSP,Bluetooth, USB, Dual CAN Interface
| Part | Package / Case | Number of I/O | Operating Temperature [Max] | Operating Temperature [Min] | Mounting Type | Interface | Supplier Device Package | RAM Size | Controller Series | Core Processor | Voltage - Supply [Min] | Voltage - Supply [Max] | Applications | Program Memory Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Texas Instruments | 224-LFBGA | 64 | 85 °C | -40 °C | Surface Mount | ACCESS.bus Audio Bluetooth CAN EBI/EMI I2S Microwire/SPI UART/USART USB OTG | 224-NFBGA (13x13) | 44 K | CP3000 | CR16C | 3 V | 3.3 V | Connectivity Processor | External Program Memory |
Texas Instruments | 224-LFBGA | 64 | 85 °C | -40 °C | Surface Mount | ACCESS.bus Audio Bluetooth CAN EBI/EMI I2S Microwire/SPI UART/USART USB OTG | 224-NFBGA (13x13) | 44 K | CP3000 | CR16C | 3 V | 3.3 V | Connectivity Processor | External Program Memory |
Texas Instruments | 144-LFBGA | 36 | 85 °C | -40 °C | Surface Mount | ACCESS.bus Audio Bluetooth CAN EBI/EMI I2S Microwire/SPI UART/USART USB OTG | 144-FBGA (10x10) | 44 K | CP3000 | CR16C | 3 V | 3.3 V | Connectivity Processor | External Program Memory |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
Description
General part information
CP3SP33 Series
The CP3SP33 connectivity processor combines high performance with the massive integration needed for embedded Bluetooth applications. A powerful RISC core with 4Kbyte instruction cache and a Teak® DSP coprocessor provides high computing bandwidth, DMA-driven hardware communications peripherals provide high I/O bandwidth, and an external bus provides system expandability.
On-chip communications peripherals include: Bluetooth Lower Link Controller, Universal Serial Bus (2.0) OTG node and host controller, dual CAN, dual Microwire/Plus/SPI, dual ACCESS.bus, quad UART, 10-bit A/D converter, and telematics/audio codec. Additional on-chip peripherals include DMA controller, dual CVSD/PCM conversion module, I2S and AAI digital audio bus interfaces, Timing and Watchdog Unit, dual Versatile Timer Unit, dual Multi-Function Timer, and Multi-Input Wake-Up (MIWU) unit.
In addition to providing the features needed for the next generation of embedded Bluetooth products, the CP3SP33 is backed up by the software resources that designers need for rapid time-to-market, including an operating system, Bluetooth protocol stack implementation, peripheral drivers, reference designs, and an integrated development environment. Combined with an external program memory and a Bluetooth radio transceiver such as National’s LMX5252, the CP3SP33 provides a complete Bluetooth system solution.
Documents
Technical documentation and resources