Integrated Circuits (ICs)

A54SX72A-2FG484

Active

SXA FPGA, 108K SYSTEM GATES 484 PBGA 27X27X2.44MM TRAY ROHS COMPLIANT: YES

Search across all available documentation for this part.

Integrated Circuits (ICs)

Active

SXA FPGA, 108K SYSTEM GATES 484 PBGA 27X27X2.44MM TRAY ROHS COMPLIANT: YES

Technical Specifications

Parameters and characteristics for this part

Low Power Anitfuse FPGA

Part	Supplier Device Package	Voltage - Supply [Min]	Voltage - Supply [Max]	Package / Case	Mounting Type	Operating Temperature [Max]	Operating Temperature [Min]	Number of LABs/CLBs	Number of I/O	Number of Gates
Microchip Technology A54SX72A-CQ256	256-CQFP (75x75)	2.25 V	5.25 V	256-BFCQFP with Tie Bar	Surface Mount	70 °C	0 °C	6036	203	108000
Microchip Technology A54SX72A-1CQ208M	208-CQFP (75x75)	2.25 V	5.25 V	208-BFCQFP with Tie Bar	Surface Mount	125 °C	-55 °C	6036	171	108000
Microchip Technology A54SX72A-2FG256I	256-FPBGA (17x17)	2.25 V	5.25 V	256-BGA	Surface Mount	85 °C	-40 °C	6036	203	108000
Microchip Technology A54SX72A-FG484A	484-FPBGA (27X27)	2.25 V	5.25 V	484-BGA	Surface Mount	125 °C	-40 °C	6036	360	108000
Microchip Technology A54SX72A-FGG256	256-FPBGA (17x17)	2.25 V	5.25 V	256-BGA	Surface Mount	70 °C	0 °C	6036	203	108000
Microchip Technology A54SX72A-1FGG256	256-FPBGA (17x17)	2.25 V	5.25 V	256-BGA	Surface Mount	70 °C	0 °C	6036	203	108000
Microchip Technology A54SX72A-CQ208M	208-CQFP (75x75)	2.25 V	5.25 V	208-BFCQFP with Tie Bar	Surface Mount	125 °C	-55 °C	6036	171	108000
Microchip Technology A54SX72A-FGG484M	484-FPBGA (27X27)	2.25 V	5.25 V	484-BGA	Surface Mount	125 °C	-55 °C	6036	360	108000
Microchip Technology A54SX72A-2FGG256I	256-FPBGA (17x17)	2.25 V	5.25 V	256-BGA	Surface Mount	85 °C	-40 °C	6036	203	108000
Microchip Technology A54SX72A-2FG484	484-FPBGA (27X27)	2.25 V	5.25 V	484-BGA	Surface Mount	70 °C	0 °C	6036	360	108000

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

SX-A

devices can be used to generate system-wide savings by integrating multiple

functions into a low cost, single-chip solution. Providing a combination of

Technical documentation and resources