Discrete Semiconductor Products

2N6287

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Microchip Technology

TRANS DARLINGTON PNP 100V 20A 175000MW 3-PIN(2+TAB) TO-3 TRAY

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DocumentsDatasheet Product Change Notice EN

Discrete Semiconductor Products

2N6287

Active

Microchip Technology

TRANS DARLINGTON PNP 100V 20A 175000MW 3-PIN(2+TAB) TO-3 TRAY

Deep-Dive with AI

DocumentsDatasheet Product Change Notice EN

Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	2N6287

Current - Collector (Ic) (Max)	20 A
Current - Collector Cutoff (Max) [Max]	1 mA
DC Current Gain (hFE) (Min) @ Ic, Vce	1500 hFE
Mounting Type	Through Hole
Operating Temperature [Max]	175 ░C
Operating Temperature [Min]	-65 °C
Package / Case	TO-3, TO-204AA
Power - Max [Max]	175 W
Supplier Device Package	TO-204AA (TO-3)
Transistor Type	PNP - Darlington
Vce Saturation (Max) @ Ib, Ic	3 V
Voltage - Collector Emitter Breakdown (Max) [Max]	100 V

2N6287-Darlington Series

MIL-PRF-19500/505

Part	Package / Case	DC Current Gain (hFE) (Min) @ Ic, Vce	Current - Collector Cutoff (Max) [Max]	Operating Temperature [Max]	Operating Temperature [Min]	Vce Saturation (Max) @ Ib, Ic	Transistor Type	Voltage - Collector Emitter Breakdown (Max) [Max]	Supplier Device Package	Mounting Type	Power - Max [Max]	Current - Collector (Ic) (Max)
Microchip Technology 2N6287	TO-204AA TO-3	1500 hFE	1 mA	175 ░C	-65 °C	3 V	PNP - Darlington	100 V	TO-204AA (TO-3)	Through Hole	175 W	20 A

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	100	$ 62.36
Microchip Direct	N/A	1	$ 67.16
Newark	Each	100	$ 62.36
		500	$ 59.96

Description

General part information

2N6287-Darlington Series

This specification covers the performance requirements for PNP, Darlington, power, 2N6286 and 2N6287 transistors for use in particular power-switching applications. Three levels of product assurance (JAN, JANTX and JANTXV) are provided for each encapsulated device type as specified in MIL-PRF-19500/505. The device package outlines are as follows: similar to TO-3 for all encapsulated device types.