LMV1032UR-25/NOPB
ActiveANALOG INPUT MICROPHONE PREAMPLIFIER FOR 3-WIRE ELECTRET MICROPHONES
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LMV1032UR-25/NOPB
ActiveANALOG INPUT MICROPHONE PREAMPLIFIER FOR 3-WIRE ELECTRET MICROPHONES
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Technical Specifications
Parameters and characteristics for this part
| Specification | LMV1032UR-25/NOPB |
|---|---|
| Features | Microphone |
| Mounting Type | Surface Mount |
| Operating Temperature [Max] | 85 °C |
| Operating Temperature [Min] | -40 °C |
| Output Type | 1-Channel (Mono) |
| Package / Case | DSBGA, 4-XFBGA |
| Supplier Device Package | 4-DSBGA |
| Type | Class AB |
| Voltage - Supply [Max] | 5 V |
| Voltage - Supply [Min] | 1.7 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Cut Tape (CT) | 1 | $ 3.41 | |
| 10 | $ 2.23 | |||
| 25 | $ 1.92 | |||
| 100 | $ 1.57 | |||
| Digi-Reel® | 1 | $ 3.41 | ||
| 10 | $ 2.23 | |||
| 25 | $ 1.92 | |||
| 100 | $ 1.57 | |||
| Tape & Reel (TR) | 250 | $ 1.25 | ||
| 500 | $ 1.16 | |||
| 750 | $ 1.11 | |||
| 1250 | $ 1.06 | |||
| 1750 | $ 1.03 | |||
| 2500 | $ 1.00 | |||
| 6250 | $ 0.93 | |||
| Texas Instruments | SMALL T&R | 1 | $ 2.12 | |
| 100 | $ 1.75 | |||
| 250 | $ 1.26 | |||
| 1000 | $ 0.95 | |||
Description
General part information
LMV1032 Series
The LMV1032s are an audio amplifier series for small form factor electret microphones. They are designed to replace the JFET preamp currently being used. The LMV1032 series is ideal for extended battery life applications, such as a Bluetooth communication link. The addition of a third pin to an electret microphones that incorporates an LMV1032 allows for a dramatic reduction in supply current as compared to the JFET equipped electret microphone. Microphone supply current is thus reduced to 60 µA, assuring longer battery life. The LMV1032 series is specified for supply voltages from 1.7V to 5V, and has fixed voltage gains of 6 dB, 15 dB and 25 dB.
The LMV1032 series offers low output impedance over the voice bandwidth, excellent power supply rejection (PSRR), and stability over temperature.
The devices are offered in space saving 4-bump ultra thin DSBGA lead free packages and are thus ideally suited for the form factor of miniature electret microphone packages. These extremely miniature packages have the Large Dome Bump (LDB) technology. This DSBGA technology is designed for microphone PCBs requiring 1 kg adhesion criteria.
Documents
Technical documentation and resources
