LMV1032 Series

Analog input microphone preamplifier for 3-wire electret microphones

Catalog

Analog input microphone preamplifier for 3-wire electret microphones

Part	Supplier Device Package	Type	Mounting Type	Features	Package / Case	Voltage - Supply [Max]	Voltage - Supply [Min]	Operating Temperature [Max]	Operating Temperature [Min]	Output Type
Texas Instruments LMV1032UPX-15/NOPB	4-DSBGA	Class AB	Surface Mount	Microphone	4-XFBGA	5 V	1.7 V	85 °C	-40 °C	1-Channel (Mono)
Texas Instruments LMV1032URX-15/NOPB	4-DSBGA	Class AB	Surface Mount	Microphone	4-XFBGA DSBGA	5 V	1.7 V	85 °C	-40 °C	1-Channel (Mono)
Texas Instruments LMV1032UPX-06/NOPB	4-DSBGA	Class AB	Surface Mount	Microphone	4-XFBGA	5 V	1.7 V	85 °C	-40 °C	1-Channel (Mono)
Texas Instruments LMV1032UP-06/NOPB	4-DSBGA	Class AB	Surface Mount	Microphone	4-XFBGA DSBGA	5 V	1.7 V	85 °C	-40 °C	1-Channel (Mono)
Texas Instruments LMV1032UR-25/NOPB	4-DSBGA	Class AB	Surface Mount	Microphone	4-XFBGA DSBGA	5 V	1.7 V	85 °C	-40 °C	1-Channel (Mono)
Texas Instruments LMV1032UP-25/NOPB	4-DSBGA	Class AB	Surface Mount	Microphone	4-XFBGA DSBGA	5 V	1.7 V	85 °C	-40 °C	1-Channel (Mono)
Texas Instruments LMV1032UR-15/NOPB	4-DSBGA	Class AB	Surface Mount	Microphone	4-XFBGA DSBGA	5 V	1.7 V	85 °C	-40 °C	1-Channel (Mono)

Catalog

Analog input microphone preamplifier for 3-wire electret microphones

Key Features

• (Typical LMV1032-15, 1.7V Supply; Unless Otherwise Noted)Output Voltage Noise (A-weighted) −89 dBVLow Supply Current 60 μASupply Voltage 1.7V to 5VPSRR 70 dBSignal to Noise Ratio 61 dBInput Capacitance 2 pFInput Impedance >100 MΩOutput Impedance <200ΩMax Input Signal 170 mVPPTemperature Range −40°C to 85°CLarge Dome 4-Bump DSBGA Package with Improved Adhesion Technology.All trademarks are the property of their respective owners.(Typical LMV1032-15, 1.7V Supply; Unless Otherwise Noted)Output Voltage Noise (A-weighted) −89 dBVLow Supply Current 60 μASupply Voltage 1.7V to 5VPSRR 70 dBSignal to Noise Ratio 61 dBInput Capacitance 2 pFInput Impedance >100 MΩOutput Impedance <200ΩMax Input Signal 170 mVPPTemperature Range −40°C to 85°CLarge Dome 4-Bump DSBGA Package with Improved Adhesion Technology.All trademarks are the property of their respective owners.

Description

The LMV1032s are an audio amplifier series for small form factor electret microphones. They are designed to replace the JFET preamp currently being used. The LMV1032 series is ideal for extended battery life applications, such as a Bluetooth communication link. The addition of a third pin to an electret microphones that incorporates an LMV1032 allows for a dramatic reduction in supply current as compared to the JFET equipped electret microphone. Microphone supply current is thus reduced to 60 µA, assuring longer battery life. The LMV1032 series is specified for supply voltages from 1.7V to 5V, and has fixed voltage gains of 6 dB, 15 dB and 25 dB. The LMV1032 series offers low output impedance over the voice bandwidth, excellent power supply rejection (PSRR), and stability over temperature. The devices are offered in space saving 4-bump ultra thin DSBGA lead free packages and are thus ideally suited for the form factor of miniature electret microphone packages. These extremely miniature packages have the Large Dome Bump (LDB) technology. This DSBGA technology is designed for microphone PCBs requiring 1 kg adhesion criteria. The LMV1032s are an audio amplifier series for small form factor electret microphones. They are designed to replace the JFET preamp currently being used. The LMV1032 series is ideal for extended battery life applications, such as a Bluetooth communication link. The addition of a third pin to an electret microphones that incorporates an LMV1032 allows for a dramatic reduction in supply current as compared to the JFET equipped electret microphone. Microphone supply current is thus reduced to 60 µA, assuring longer battery life. The LMV1032 series is specified for supply voltages from 1.7V to 5V, and has fixed voltage gains of 6 dB, 15 dB and 25 dB. The LMV1032 series offers low output impedance over the voice bandwidth, excellent power supply rejection (PSRR), and stability over temperature. The devices are offered in space saving 4-bump ultra thin DSBGA lead free packages and are thus ideally suited for the form factor of miniature electret microphone packages. These extremely miniature packages have the Large Dome Bump (LDB) technology. This DSBGA technology is designed for microphone PCBs requiring 1 kg adhesion criteria.