
SN74LVC1G07MDCKREP
ActiveENHANCED PRODUCT SINGLE 1.65-V TO 5.5-V BUFFER WITH OPEN-DRAIN OUTPUTS
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SN74LVC1G07MDCKREP
ActiveENHANCED PRODUCT SINGLE 1.65-V TO 5.5-V BUFFER WITH OPEN-DRAIN OUTPUTS
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Technical Specifications
Parameters and characteristics for this part
| Specification | SN74LVC1G07MDCKREP |
|---|---|
| Current - Output High, Low [custom] | - |
| Current - Output High, Low [custom] | 32 mA |
| Logic Type | Buffer, Non-Inverting |
| Mounting Type | Surface Mount |
| Number of Bits per Element | 1 |
| Number of Elements | 1 |
| Operating Temperature [Max] | 125 °C |
| Operating Temperature [Min] | -55 °C |
| Output Type | Open Drain |
| Package / Case | SC-70-5, 5-TSSOP, SOT-353 |
| Supplier Device Package | SC-70-5 |
| Voltage - Supply [Max] | 5.5 V |
| Voltage - Supply [Min] | 1.65 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Cut Tape (CT) | 1 | $ 1.81 | |
| 10 | $ 1.63 | |||
| 25 | $ 1.54 | |||
| 100 | $ 1.31 | |||
| 250 | $ 1.23 | |||
| 500 | $ 1.07 | |||
| 1000 | $ 0.89 | |||
| Digi-Reel® | 1 | $ 1.81 | ||
| 10 | $ 1.63 | |||
| 25 | $ 1.54 | |||
| 100 | $ 1.31 | |||
| 250 | $ 1.23 | |||
| 500 | $ 1.07 | |||
| 1000 | $ 0.89 | |||
| Tape & Reel (TR) | 3000 | $ 0.83 | ||
| 6000 | $ 0.80 | |||
| Texas Instruments | LARGE T&R | 1 | $ 1.50 | |
| 100 | $ 1.16 | |||
| 250 | $ 0.85 | |||
| 1000 | $ 0.61 | |||
Description
General part information
SN74LVC1G07-Q1 Series
The SN74LVC1G07-Q1 is a single channel open-drain buffer/driver qualified for automotive applications. This is designed for 1.65-V to 5.5-V VCCoperation.
The output of the SN74LVC1G07-Q1 device is open drain and can be connected to other open-drain outputs to implement active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA.
This device is fully specified for partial-power-down applications using Ioff.The Ioffcircuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
Documents
Technical documentation and resources