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Technical Specifications
Parameters and characteristics for this part
| Specification | HMC558LC3BTR |
|---|---|
| Frequency [Max] | 14 GHz |
| Frequency [Min] | 5.5 GHz |
| Mounting Type | Surface Mount |
| Number of Mixers | 1 |
| Package / Case | 12-VFCQFN Exposed Pad |
| RF Type | General Purpose |
| Secondary Attributes | Up/Down Converter |
| Supplier Device Package | 12-CSMT (3x3) |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Arrow | N/A | 51 | $ 29.46 | |
| 101 | $ 25.71 | |||
| 301 | $ 24.38 | |||
| 501 | $ 20.80 | |||
| 1501 | $ 20.20 | |||
Description
General part information
HMC558A Series
The HMC558 devices are passive (HMC558) and general purpose (HMC558LC3B) double-balanced mixers that are available in a chip (HMC558) and a leadless RoHS compliant SMT package (HMC558LC3B), both of which can be used as an upconverter or downconverter between 5.5 GHz and 14.0 GHz. These mixers are fabricated in a GaAs metal semiconductor field effect transistor (MESFET) process, and require no external components or matching circuitry. The HMC558G devices provide excellent LO to RF and LO to IF isolation due to optimized balun structures and operates with LO drive levels as low as 9 dBm. Measurements were made with the HMC558 chip mounted into in a 50 Ω test fixture and includes the parasitic effects of wire bond assembly. Connections were made with a 1 mil wire bond with minimal length (<12 mil). The RoHS compliant HMC558LC3B eliminates the need for wire bonding, and is compatible with high volume surface mount manufacturing techniques.ApplicationsMicrowave radioMilitary end useSpaceCommunications, radar and electronic warfare (EW)Test equipment and sensorsPoint-to-point radiosPoint-to-multipoint radios
Documents
Technical documentation and resources