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GNP1150TCA-ZE2
Discrete Semiconductor Products

GNP1150TCA-ZE2

Active
Rohm Semiconductor

GALLIUM NITRIDE (GAN) TRANSISTOR, 650 V, 11 A, 0.15 OHM, 2.7 NC, DFN8080AK, SURFACE MOUNT

Deep-Dive with AI

Search across all available documentation for this part.

DocumentsDatasheetMethod for Calculating Junction Temperature from Transient Thermal Resistance Data+24
GNP1150TCA-ZE2
Discrete Semiconductor Products

GNP1150TCA-ZE2

Active
Rohm Semiconductor

GALLIUM NITRIDE (GAN) TRANSISTOR, 650 V, 11 A, 0.15 OHM, 2.7 NC, DFN8080AK, SURFACE MOUNT

Deep-Dive with AI

DocumentsDatasheetMethod for Calculating Junction Temperature from Transient Thermal Resistance Data+24

Technical Specifications

Parameters and characteristics for this part

SpecificationGNP1150TCA-ZE2
Current - Continuous Drain (Id) @ 25°C11 A
Drain to Source Voltage (Vdss)650 V
Drive Voltage (Max Rds On, Min Rds On) [Max]5 V
Drive Voltage (Max Rds On, Min Rds On) [Min]5.5 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs [Max]2.7 nC
Input Capacitance (Ciss) (Max) @ Vds [Max]112 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / Case8-PowerDFN
Power Dissipation (Max) [Max]62.5 W
Rds On (Max) @ Id, Vgs195 mOhm
Supplier Device PackageDFN8080AK
TechnologyGaNFET (Gallium Nitride)
Vgs (Max) [Max]6 V
Vgs (Max) [Min]-10 V
Vgs(th) (Max) @ Id2.4 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 5.11
10$ 4.29
100$ 3.47
500$ 3.08
1000$ 2.64
Digi-Reel® 1$ 5.11
10$ 4.29
100$ 3.47
500$ 3.08
1000$ 2.64
N/A 2611$ 6.09
Tape & Reel (TR) 3500$ 2.39
NewarkEach (Supplied on Cut Tape) 1$ 5.99
10$ 4.11
25$ 3.93
50$ 3.41
100$ 2.88
250$ 2.72
500$ 2.57
1000$ 2.49

Description

General part information

GNP1150TCA-Z Series

EcoGaN™, 650V 11A DFN8080AK, E-mode Gallium-Nitride(GaN) FET

Documents

Technical documentation and resources

Datasheet

Datasheet

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

4 Steps for Successful Thermal Designing of Power Devices

White Paper

GaN Flyback Circuit – Transient Simulation (ROHM Solution Simulator)

Simulations

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Method for Monitoring Switching Waveform

Schematic Design & Verification

What Is Thermal Design

Thermal Design

ROHM's EcoGaN™ Solutions Contribute to Greater Miniaturization and Energy Savings

White Paper

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Method of lifetime estimation of EcoGaN™ in soft-switching operations

White Paper

How to Use LTspice&reg; Models

Schematic Design & Verification

Generation Mechanism of Voltage Surge on Commutation Side (Basic)

Technical Article

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Types and Features of Transistors

Application Note

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design