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DSBGA (YFF)
Integrated Circuits (ICs)

TPA2011D1YFFR

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Texas Instruments

3.2-W, MONO, ANALOG INPUT CLASS-D AUDIO AMPLIFIER WITH AUTO-RECOVERING SHORT-CIRCUIT PROTECTION

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DSBGA (YFF)
Integrated Circuits (ICs)

TPA2011D1YFFR

Active
Texas Instruments

3.2-W, MONO, ANALOG INPUT CLASS-D AUDIO AMPLIFIER WITH AUTO-RECOVERING SHORT-CIRCUIT PROTECTION

Technical Specifications

Parameters and characteristics for this part

SpecificationTPA2011D1YFFR
FeaturesShort-Circuit and Thermal Protection, Differential Inputs, Shutdown
Max Output Power x Channels @ Load1, 3.24 W
Mounting TypeSurface Mount
Operating Temperature [Max]85 °C
Operating Temperature [Min]-40 °C
Output Type1-Channel (Mono)
Package / CaseDSBGA, 9-UFBGA
Supplier Device Package9-DSBGA
TypeClass D
Voltage - Supply [Max]5.5 V
Voltage - Supply [Min]2.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.85
10$ 0.75
25$ 0.70
100$ 0.57
250$ 0.53
500$ 0.45
1000$ 0.36
Digi-Reel® 1$ 0.85
10$ 0.75
25$ 0.70
100$ 0.57
250$ 0.53
500$ 0.45
1000$ 0.36
Tape & Reel (TR) 3000$ 0.33
6000$ 0.31
15000$ 0.29
30000$ 0.28
Texas InstrumentsLARGE T&R 1$ 0.32
100$ 0.22
250$ 0.17
1000$ 0.11

Description

General part information

TPA2011D1 Series

The TPA2011D1 is a 3.2-W high efficiency filter-free class-D audio power amplifier (class-D amp) in a 1.21 mm × 1.16 mm wafer chip scale package (DSBGA) that requires only three external components.

Features like 95% efficiency, 86-dB PSRR, 1.5 mA quiescent current and improved RF immunity make the TPA2011D1 class-D amp ideal for cellular handsets. A fast start-up time of 4 ms with no audible turn-on pop makes the TPA2011D1 ideal for PDA and smart-phone applications. The TPA2011D1 allows independent gain while summing signals from separate sources, and has a low 20 µV noise floor.

The TPA2011D1 is a 3.2-W high efficiency filter-free class-D audio power amplifier (class-D amp) in a 1.21 mm × 1.16 mm wafer chip scale package (DSBGA) that requires only three external components.