MC33FS8530A1ESR2

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SYSTEM BASIS CHIP FS8500

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Integrated Circuits (ICs)

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SYSTEM BASIS CHIP FS8500

Technical Specifications

Parameters and characteristics for this part

Specification	MC33FS8530A1ESR2

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Part	Operating Temperature [Min]	Operating Temperature [Max]	Mounting Type	Package / Case	Applications	Voltage - Supply	Current - Supply	Supplier Device Package
Freescale Semiconductor - NXP MC33FS8530A4ESR2
Freescale Semiconductor - NXP MC33FS8530A0ESR2
Freescale Semiconductor - NXP MC33FS8530A0ES	-40 °C	125 °C	Surface Mount Wettable Flank	56-VFQFN Exposed Pad	System Basis Chip	60 VDC	15 mA	56-HVQFN (8x8)
Freescale Semiconductor - NXP MC33FS8530A4ES
Freescale Semiconductor - NXP MC33FS8530A1ESR2
Freescale Semiconductor - NXP MC33FS8530A1ES	-40 °C	125 °C	Surface Mount Wettable Flank	56-VFQFN Exposed Pad	System Basis Chip	60 VDC	15 mA	56-HVQFN (8x8)

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tape & Reel (TR)	4000	$ 6.57

General part information

PMIC

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