Integrated Circuits (ICs)

MC33FS8530A0ES

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SYSTEM BASIS CHIP, HVQFN-EP-56, 125DEG C ROHS COMPLIANT: YES

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Integrated Circuits (ICs)

Active

SYSTEM BASIS CHIP, HVQFN-EP-56, 125DEG C ROHS COMPLIANT: YES

Technical Specifications

Parameters and characteristics for this part

Specification	MC33FS8530A0ES

Applications	System Basis Chip
Current - Supply	15 mA
Mounting Type	Wettable Flank, Surface Mount
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-40 °C
Package / Case	56-VFQFN Exposed Pad
Supplier Device Package	56-HVQFN (8x8)
Voltage - Supply	60 VDC

Part	Operating Temperature [Min]	Operating Temperature [Max]	Mounting Type	Package / Case	Applications	Voltage - Supply	Current - Supply	Supplier Device Package
Freescale Semiconductor - NXP MC33FS8530A4ESR2
Freescale Semiconductor - NXP MC33FS8530A0ESR2
Freescale Semiconductor - NXP MC33FS8530A0ES	-40 °C	125 °C	Surface Mount Wettable Flank	56-VFQFN Exposed Pad	System Basis Chip	60 VDC	15 mA	56-HVQFN (8x8)
Freescale Semiconductor - NXP MC33FS8530A4ES
Freescale Semiconductor - NXP MC33FS8530A1ESR2
Freescale Semiconductor - NXP MC33FS8530A1ES	-40 °C	125 °C	Surface Mount Wettable Flank	56-VFQFN Exposed Pad	System Basis Chip	60 VDC	15 mA	56-HVQFN (8x8)

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

System Basis Chip PMIC 56-HVQFN (8x8)

Technical documentation and resources