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LMG3410R070RWHR

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Texas Instruments

600-V 70MΩ GAN WITH INTEGRATED DRIVER AND PROTECTION

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VQFN (RWH)
Integrated Circuits (ICs)

LMG3410R070RWHR

Active
Texas Instruments

600-V 70MΩ GAN WITH INTEGRATED DRIVER AND PROTECTION

Technical Specifications

Parameters and characteristics for this part

SpecificationLMG3410R070RWHR
Current - Output (Max) [Max]12 A
Fault ProtectionOver Temperature, Over Current, UVLO
FeaturesBootstrap Circuit, 5V Regulated Output
Input TypeNon-Inverting
InterfaceLogic, PWM
Mounting TypeSurface Mount
Number of Outputs1
Operating Temperature [Max]125 ¯C
Operating Temperature [Min]-40 °C
Output ConfigurationHigh Side
Output TypeN-Channel
Package / Case32-VQFN Exposed Pad
Ratio - Input:Output [custom]1:1
Rds On (Typ)70 mOhm
Supplier Device Package32-VQFN (8x8)
Voltage - Load [Max]480 V
Voltage - Supply (Vcc/Vdd) [Max]18 V
Voltage - Supply (Vcc/Vdd) [Min]9.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTape & Reel (TR) 2000$ 7.50
Texas InstrumentsLARGE T&R 1$ 9.63
100$ 8.41
250$ 6.48
1000$ 5.80

Description

General part information

LMG3410R070 Series

The LMG341xR070 GaN power stage with integrated driver and protection enables designers to achieve new levels of power density and efficiency in power electronics systems. The LMG341x’s inherent advantages over silicon MOSFETs include ultra-low input and output capacitance, zero reverse recovery to reduce switching losses by as much as 80%, and low switch node ringing to reduce EMI. These advantages enable dense and efficient topologies like the totem-pole PFC.

The LMG341xR070 provides a smart alternative to traditional cascode GaN and standalone GaN FETs by integrating a unique set of features to simplify design, maximize reliability and optimize the performance of any power supply. Integrated gate drive enables 100V/ns switching with near zero Vds ringing, <100 ns current limiting self-protects against unintended shoot-through events, Overtemperature shutdown prevents thermal runaway, and system interface signals provide self-monitoring capability.

The LMG341xR070 GaN power stage with integrated driver and protection enables designers to achieve new levels of power density and efficiency in power electronics systems. The LMG341x’s inherent advantages over silicon MOSFETs include ultra-low input and output capacitance, zero reverse recovery to reduce switching losses by as much as 80%, and low switch node ringing to reduce EMI. These advantages enable dense and efficient topologies like the totem-pole PFC.

Documents

Technical documentation and resources

Let’s GaN together, reliably

Technical article

Direct-drive configuration for GaN devices (Rev. A)

White paper

Gallium nitride: supporting applications from watts to kilowatts

Technical article

Four key design considerations when adding energy storage to solar power grids

White paper

Designing highly efficient, powerful and fast EV charging stations

Technical article

Advancing Power Supply Solutions Through the Promise of GaN

White paper

The power to do even more with GaN

Technical article

From blue light to green power

Technical article

Using Digital Power MCUs for Intelligent EV Battery Charging

Technical article

Optimizing GaN performance with an integrated driver

White paper

Achieve Power-Dense and Efficient Digital Power Systems by Combining TI GaN FETs

White paper

Application-Relevant Qualification of Emerging Semiconductor Power Devices, GaN

White paper

Thermal Considerations for Designing a GaN Power Stage (Rev. B)

Application note

The power to innovate industrial design

Technical article

Power Tips: How GaN devices boost resonant converter efficiency

Technical article

The benefits of GaN for battery test systems

Technical article

Is integrated GaN changing the conventional wisdom?

Technical article

GaN FET Reliability to Power-line Surges Under Use-conditions

More literature

Searching for the newest innovations in power? Find them at APEC

Technical article

Achieving GaN Products With Lifetime Reliability

White paper

A Generalized Approach to Determine the Switching Lifetime of a GaN FET

More literature

為太陽能電網增添儲能功能的四項 重要設計考量

White paper

Product-level Reliability of GaN Devices

More literature

Advantages of wide band gap materials in power electronics – part 2

Technical article

結合 TI GaN FETs 與 C2000™ 即時 MCU,實現功率密集與有效率的數位電源系統

White paper

Enabling high-voltage power delivery through the power process chain

White paper

Don't forget the gate driver: it’s the muscle

Technical article

Third quadrant operation of GaN

Application note

A comprehensive methodology to qualify the reliability of GaN products

White paper

Using the LMG3410-HB-EVM Half-Bridge and LMG34XX-BB-EVM Breakout Board EVM (Rev. A)

EVM User's guide

High Voltage Half Bridge Design Guide for LMG3410 Smart GaN FET (Rev. A)

Application note

No avalanche? No problem! GaN FETs are surge robust

Technical article

LMG341xR070 600-V 70-mΩ GaN with Integrated Driver and Protection datasheet (Rev. F)

Data sheet

Wide-bandgap semiconductors: Performance and benefits of GaN versus SiC

Analog Design Journal

It’s hip to be square

Technical article

Overcurrent Protection in High-Density GaN Power Designs

Application brief

Power Tips: Improve power supply reliability with high voltage GaN devices

Technical article

TI GaN FET와 C2000™ 실시간 MCU를 결합하여 전력 밀도가 높고 효율적인 전원 시스템 달성

White paper

Redefining power management through high-voltage innovation

White paper

GaN reliability standards reach milestone

Technical article

Thermal Considerations for Designing GaN Pwr. Stage

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