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SCT4026DRC15
Discrete Semiconductor Products

SCT3060ARC15

Active
Rohm Semiconductor

SILICON CARBIDE MOSFET, SINGLE, N CHANNEL, 39 A, 650 V, 0.06 OHM, TO-247

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SCT4026DRC15
Discrete Semiconductor Products

SCT3060ARC15

Active
Rohm Semiconductor

SILICON CARBIDE MOSFET, SINGLE, N CHANNEL, 39 A, 650 V, 0.06 OHM, TO-247

Technical Specifications

Parameters and characteristics for this part

SpecificationSCT3060ARC15
Current - Continuous Drain (Id) @ 25°C39 A
Drain to Source Voltage (Vdss)650 V
Drive Voltage (Max Rds On, Min Rds On)18 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs [Max]58 nC
Input Capacitance (Ciss) (Max) @ Vds852 pF
Mounting TypeThrough Hole
Operating Temperature175 °C
Package / CaseTO-247-4
Power Dissipation (Max) [Max]165 W
Rds On (Max) @ Id, Vgs78 mOhm
Supplier Device PackageTO-247-4L
TechnologySiC (Silicon Carbide Junction Transistor)

SCT3060 Series

650V, 39A, 4-pin THD, Trench-structure, Silicon-carbide (SiC) MOSFET for Automotive

PartTechnologyCurrent - Continuous Drain (Id) @ 25°COperating TemperatureSupplier Device PackageFET TypeInput Capacitance (Ciss) (Max) @ VdsGate Charge (Qg) (Max) @ Vgs [Max]Power Dissipation (Max) [Max]Mounting TypeDrive Voltage (Max Rds On, Min Rds On)Drain to Source Voltage (Vdss)Rds On (Max) @ Id, VgsPackage / CaseGradeQualification
SCT4026DRC15
Rohm Semiconductor
SiC (Silicon Carbide Junction Transistor)
39 A
175 °C
TO-247-4L
N-Channel
852 pF
58 nC
165 W
Through Hole
18 V
650 V
78 mOhm
TO-247-4
SCT4026DRHRC15
Rohm Semiconductor
MOSFET (Metal Oxide)
39 A
175 °C
TO-247-4L
N-Channel
852 pF
58 nC
165 W
Through Hole
18 V
650 V
78 mOhm
TO-247-4
Automotive
AEC-Q101
SCT3series
Rohm Semiconductor
38 A
175 °C
TO-263-7
N-Channel
852 pF
58 nC
159 W
Surface Mount
650 V
78 mOhm
D2PAK (7 Leads + Tab)
TO-263-8
TO-263CA
Product dimension image
Rohm Semiconductor
39 A
175 °C
TO-247N
N-Channel
852 pF
58 nC
165 W
Through Hole
18 V
650 V
78 mOhm
TO-247-3
Automotive
AEC-Q101
SCT3105KRC14-back
Rohm Semiconductor
39 A
175 °C
TO-247-4L
N-Channel
852 pF
58 nC
165 W
Through Hole
18 V
650 V
78 mOhm
TO-247-4

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 365$ 11.40
Tube 1$ 11.40
10$ 10.01
450$ 8.07
NewarkEach 1$ 17.68
10$ 13.61
25$ 13.46
50$ 13.31
100$ 13.16
250$ 13.01
900$ 12.86

Description

General part information

SCT3060 Series

SCT3060AR is an SiC MOSFET featuring a trench gate structure optimized for server power supplies, solar power inverters, and EV charging stations requiring high efficiency. A new 4-pin package is used that separates the power and driver source terminals, making it possible to maximize high-speed switching performance. This improves turn ON loss in particular, and as a result the total turn ON and turn OFF losses can be reduced by as much as 35% compared with the conventional 3-pin package (TO-247N).A pioneer and industry leader in SiC technology, ROHM was the first supplier to mass produce trench-type MOSFETs that further improve efficiency while reducing power consumption over existing SiC MOSFETs.

Documents

Technical documentation and resources

Datasheet

Datasheet

Solving the challenges of driving SiC MOSFETs with new packaging developments

White Paper

Thermal Resistance Measurement Method for SiC MOSFET

Thermal Design

Types and Features of Transistors

Application Note

Gate-source voltage behaviour in a bridge configuration

Schematic Design & Verification

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

PCB Layout Thermal Design Guide

Thermal Design

Simulation Verification to Identify Oscillation between Parallel Dies during Design Phase of Power Modules

Technical Article

Notes on Gate Drive Voltage Setting and Linear Mode Application of SiC MOSFET

Technical Article

What is a Thermal Model? (SiC Power Device)

Thermal Design

How to Create Symbols for PSpice Models

Models

Notes for Calculating Power Consumption:Static Operation

Thermal Design

About Export Administration Regulations (EAR)

Export Information

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Oscillation countermeasures for MOSFETs in parallel

Schematic Design & Verification

Snubber circuit design methods for SiC MOSFET

Schematic Design & Verification

Cutting-Edge Web Simulation Tool "ROHM Solution Simulator" Capable of Complete Circuit Verification of Power Devices and Driver ICs

White Paper

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Application Note for SiC Power Devices and Modules

Schematic Design & Verification

LEADRIVE: Design, Test and System Evaluation of Silicon Carbide Power Modules and Motor Control Units

White Paper

How to Use Thermal Models

Thermal Design

Precautions during gate-source voltage measurement for SiC MOSFET

Schematic Design & Verification

Part Explanation

Application Note

4 Steps for Successful Thermal Designing of Power Devices

White Paper

What Is Thermal Design

Thermal Design

Generation Mechanism of Voltage Surge on Commutation Side (Basic)

Technical Article

Method for Monitoring Switching Waveform

Schematic Design & Verification

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

How to Suppress the Parallel Drive Oscillation in SiC Modules

Application Note

TO-247-4L_C15 Dimensions

Package Information

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

5kW High-Efficiency Fan-less Inverter

Schematic Design & Verification

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

The Problem with Traditional Vaccine Storage Freezers and How ROHM Cutting-edge Power Solutions Can Take them to the Next Level

White Paper

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

800V Three-Phase Output LLC DC/DC Resonant Converter

Schematic Design & Verification

SiC THD Condition of Soldering

Package Information

How to Use PSIM Models

Schematic Design & Verification

How to measure the oscillation occurs between parallel-connected devices

Technical Article

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

Judgment Criteria of Thermal Evaluation

Thermal Design

Basics and Design Guidelines for Gate Drive Circuits

Schematic Design & Verification

Best practices for the connection of Driver Source/Emitter terminals in discrete devices

Schematic Design & Verification

How to Use PLECS Models

Technical Article

SiC MOSFET Layout Design Considerations

Technical Article

Anti-Whisker formation

Package Information

Design Method for Comparator-less Miller Clamp Circuits

Schematic Design & Verification

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

How to Use LTspice&reg; Models

Schematic Design & Verification

Compliance of the ELV directive

Environmental Data

Calculating Power Loss from Measured Waveforms

Schematic Design & Verification

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

About Flammability of Materials

Environmental Data

Gate-Source Voltage Surge Suppression Methods

Schematic Design & Verification

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification