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Discrete Semiconductor Products

SCT3120AW7TL

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Rohm Semiconductor

SILICON CARBIDE MOSFET, SINGLE, N CHANNEL, 21 A, 650 V, 0.12 OHM, TO-263 (D2PAK)

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Discrete Semiconductor Products

SCT3120AW7TL

Active
Rohm Semiconductor

SILICON CARBIDE MOSFET, SINGLE, N CHANNEL, 21 A, 650 V, 0.12 OHM, TO-263 (D2PAK)

Technical Specifications

Parameters and characteristics for this part

SpecificationSCT3120AW7TL
Current - Continuous Drain (Id) @ 25°C21 A
Drain to Source Voltage (Vdss)650 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs38 nC
Input Capacitance (Ciss) (Max) @ Vds [Max]460 pF
Mounting TypeSurface Mount
Operating Temperature175 °C
Package / CaseTO-263CA, D2PAK (7 Leads + Tab), TO-263-8
Power Dissipation (Max) [Max]100 W
Rds On (Max) @ Id, Vgs156 mOhm
Supplier Device PackageTO-263-7
Vgs(th) (Max) @ Id5.6 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 10.61
10$ 9.34
100$ 8.08
500$ 7.32
Digi-Reel® 1$ 10.61
10$ 9.34
100$ 8.08
500$ 7.32
N/A 773$ 10.64
Tape & Reel (TR) 1000$ 6.25
NewarkEach 1$ 12.21
10$ 8.69
25$ 8.69
50$ 8.68
100$ 6.86
250$ 6.69
500$ 6.51

Description

General part information

SCT3120 Series

SCT3120AL is an SiC (Silicon Carbide) trench MOSFET. Features include high voltage resistance, low ON resistance, and fast switching speed.

Documents

Technical documentation and resources

Improvement of switching loss by driver source

Technical Article

SiC MOSFET Layout Design Considerations

Technical Article

Calculating Power Loss from Measured Waveforms

Schematic Design & Verification

How to Create Symbols for PSpice Models

Models

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Gate-Source Voltage Surge Suppression Methods

Schematic Design & Verification

Moisture Sensitivity Level

Package Information

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Anti-Whisker formation

Package Information

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Precautions during gate-source voltage measurement for SiC MOSFET

Schematic Design & Verification

Part Explanation

Application Note

PCB Layout Thermal Design Guide

Thermal Design

800V Three-Phase Output LLC DC/DC Resonant Converter

Schematic Design & Verification

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

TO-263-7L Inner Structure

Package Information

How to measure the oscillation occurs between parallel-connected devices

Technical Article

Notes on Gate Drive Voltage Setting and Linear Mode Application of SiC MOSFET

Technical Article

Application Note for SiC Power Devices and Modules

Schematic Design & Verification

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

5kW High-Efficiency Fan-less Inverter

Schematic Design & Verification

Judgment Criteria of Thermal Evaluation

Thermal Design

4 Steps for Successful Thermal Designing of Power Devices

White Paper

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

What Is Thermal Design

Thermal Design

Basics and Design Guidelines for Gate Drive Circuits

Schematic Design & Verification

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Types and Features of Transistors

Application Note

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

What is a Thermal Model? (SiC Power Device)

Thermal Design

Best practices for the connection of Driver Source/Emitter terminals in discrete devices

Schematic Design & Verification

Snubber circuit design methods for SiC MOSFET

Schematic Design & Verification

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

How to Suppress the Parallel Drive Oscillation in SiC Modules

Application Note

TO-263-7L Explanation for Marking

Package Information

Simulation Verification to Identify Oscillation between Parallel Dies during Design Phase of Power Modules

Technical Article

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Condition of Soldering

Package Information

Oscillation countermeasures for MOSFETs in parallel

Schematic Design & Verification

SCT3120AW7 Data Sheet

Data Sheet

Two-Resistor Model for Thermal Simulation

Thermal Design

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

The Problem with Traditional Vaccine Storage Freezers and How ROHM Cutting-edge Power Solutions Can Take them to the Next Level

White Paper

How to Use LTspice&reg; Models

Schematic Design & Verification

Generation Mechanism of Voltage Surge on Commutation Side (Basic)

Technical Article

Compliance of the ELV directive

Environmental Data

Method for Monitoring Switching Waveform

Schematic Design & Verification

Thermal Resistance Measurement Method for SiC MOSFET

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

How to Use Thermal Models

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Cutting-Edge Web Simulation Tool "ROHM Solution Simulator" Capable of Complete Circuit Verification of Power Devices and Driver ICs

White Paper

Design Method for Comparator-less Miller Clamp Circuits

Schematic Design & Verification

LEADRIVE: Design, Test and System Evaluation of Silicon Carbide Power Modules and Motor Control Units

White Paper

TO-263-7L Package Dimensions

Package Information

About Flammability of Materials

Environmental Data

About Export Administration Regulations (EAR)

Export Information

How to Use PSIM Models

Schematic Design & Verification

Gate-source voltage behaviour in a bridge configuration

Schematic Design & Verification

TO-263-7L Taping Information

Package Information

Solving the challenges of driving SiC MOSFETs with new packaging developments

White Paper

How to Use PLECS Models

Technical Article